Capacitively coupled plasma (CCP) has gain wide attention due to its important applications in industry. The researches of CCP mainly focus on the discharge characteristics and plasma parameters under different discharge conditions to obtain a good understanding of the discharge, find good methods of controlling the charged particle properties, and improve the process performance and efficiency. The controlling of plasma parameters is based on the following three aspects: gas, chamber, and power source. Changing these discharge conditions can directly influence the sheath dynamics and the charged particle heating process, which can further influence the electron and ion distribution functions, the plasma uniformity, and the production of neutral particles, etc. Based on a review of the recent years’ researches of CCP, the electron heating dynamics and several common methods of controlling the plasma parameters, i.e. voltage waveform tailoring, realistic secondary electron emission, and magnetized capacitively coupled plasma are introduced and discussed in detail in this work.