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中国物理学会期刊

石墨烯基复合热界面材料导热性能研究进展

CSTR: 32037.14.aps.71.20220306

Research progress of thermal transport in graphene-based thermal interfacial composite materials

CSTR: 32037.14.aps.71.20220306
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  • 随着微纳电子器件热功率密度的迅速增长, 控制其温度已成为电子信息产业发展和应用的迫切需求. 研发高性能热界面材料是热管理关键问题之一. 由于高导热特性,石墨烯基复合热界面材料成为研究热点. 从原子尺度深入理解复合体系中声子输运机理, 有助于提升复合体系导热性能. 本文从石墨烯内热阻和和复合体系界面热阻两方面介绍和讨论石墨烯复合体系导热的研究进展、导热机制以及调控方式. 最后对该方向研究成果和发展趋势进行总结和展望.

     

    With the rapid increase of the thermal power density of microelectronic devices and circuits, controlling its temperature has become an urgent need for the development and application of the electronic industry. By virtue of the ultrahigh thermal conductivity of graphene, developing high-performance graphene-based composite thermal interface materials has attracted much research attention and become one of hot research topics. The understanding of phonon transport mechanism in graphene-based composites at atomic scale can be helpful to enhance the heat conductive capability of composites systems. In this review, focused on graphene-based thermal interfaces materials, the heat conduction mechanism and the regulating strategy are introduced on both the internal thermal resistance and interfacial thermal resistance. Finally, the reseach progress and opportunities for future studies are also summarized.

     

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