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中国物理学会期刊

基于双相弛豫理论的石墨烯中热波传播

CSTR: 32037.14.aps.75.20251335

Thermal wave propagation in graphene based on two-phase relaxation theory

CSTR: 32037.14.aps.75.20251335
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  • 为研究石墨烯中的非稳态热波和热扩散的相互作用机制, 引入热流矢量弛豫时间τq和温度梯度弛豫时间τT, 建立了双相弛豫理论模型. 分别基于Bromwich积分方法和有限差分方法讨论此模型的解析解和数值解, 研究了双相弛豫时间参数B对热波与热扩散相互作用和热输运模式调控机制的影响规律, 揭示了三阶偏导项对局部热波扰动的独特贡献. 建立锯齿形石墨烯短脉冲热冲击分子动力学模型以揭示热波与热扩散相互作用特征, 并校核模型计算参数. 研究结果表明: 纵波、面内横波、面外横波三种模式中均存在弹性波、热波、热扩散三种热能传递方式; 除面外热波波速高于面外横向弹性波波速外, 其他两种热波传播速度均低于对应的弹性波波速. 分子动力学模拟校核了双相弛豫理论模型计算参数的可靠性, 进一步揭示了热波辐射与热扩散的相互耦合作用. 本研究表明双相弛豫模型可精确描述微纳器件的非平衡热行为, 可为集成电路微器件的热辐射和热扩散防护提供理论参考.

     

    In order to distinguish the interaction responses between unsteady thermal waves and thermal diffusion in graphene, the relaxation time of the heat flux vector τq and the relaxation time of the temperature gradient τT are introduced based on the Fourier's law, and a two-phase relaxation theoretical model is established. Using parameter B, which describes the ratio of relaxation times between two phases, to reveal the influence of the interaction between thermal waves and thermal diffusion and to investigate the regulation mechanism of heat transport modes. When B approaches zero, the thermal wave effect dominates the heat transfer. When B approaches 0.5, the thermal diffusion characteristics are significant. When B is between zero and 0.5, both of them jointly dominate the heat transfer, and the interaction between the two is of great significance. The results uncover the rules of thermal diffusion induced wave attenuation and thermal wave promoted thermal diffusion. They exhibit strong coupling characteristics. The unique contribution of third-order partial derivatives to local thermal wave disturbances is also revealed.
    A molecular dynamics model of short-pulse thermal shock for zigzag graphene is developed to reveal the coupling behaviors between thermal waves and thermal diffusion. The calculation parameters of the two-phase relaxation theoretical model are calibrated. The temperature field following the second sound is the outcome of the combined action of thermal waves and thermal diffusion. It is worth noting that except for the out-of-plane thermal wave, which has a higher speed than the out-of-plane transverse elastic wave, the speeds of the other two thermal waves are both lower than their corresponding elastic wave velocities.
    The above results indicate that the two-phase relaxation model can accurately depict the non-equilibrium thermal behaviors of micro-and nano-scale devices and can provide a theoretical basis for protecting micro-components in integrated circuits against thermal radiation and thermal diffusion.

     

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