Thermometry based on nitrogen-vacancy (NV) centers in diamond offers intrinsically high sensitivity, rapid response, and wide working range, and is regarded as a promising approach for in-situ temperature measurement in integrated circuits, micro-nanoscale fabrication, and related fields. However, existing NV centers thermometer is limited by low accuracy, large size, and poor resistance to environmental disturbances. To design a high-precision, highly disturbance-resistant portable NV centers thermometer, a thermal deformation suppression method based on optical path and structural design has been studied. Firstly, the effects of thermally induced deformation on the laser spot position, polarization state, and power stability are theoretically analyzed through the derivation of the Jones matrix of the pump light path. Secondly, a three-dimensional thermal structural coupled finite element model of the thermometer is established, and the working conditions of different frame materials, the presence or absence of ceramic gaskets, and different fixing methods of optical components are simulated and optimized. Microcrystalline glass material is used for the key frame near the internal heat source, and zirconia ceramic gaskets are set between the main structure and the optical frame. Moreover, the optical elements are fixed using side bonding. The thermal disturbance displacement of critical optical components has been reduced by approximately 83%. Subsequently, a portable NV centers thermometer is built based on the simulation optimization scheme. Tests such as temperature measurement sensitivity and Allan variance have been conducted, and a complete standard uncertainty evaluation system has been discussed. The average thermometric sensitivity within 10 Hz reaches 0.05 K/Hz^1/2, the Allan variance is reduced by approximately 56.4% compared with that of the unoptimized system, the standard uncertainty of temperature measurement is 0.10 K after optimization. Finally, the NV centers are directly manipulated using the microwave field emitted by the radio-frequency chip, enabling temperature measurements on the chip surface. The temperature shows a decreasing trend from the bottom feeding area outward with a maximum temperature difference of 48.9 K at 10 points, and then reveals the uniformity of temperature within the bulk diamond.In the future, research will be conducted on the coating technology of nanodiamonds on the surface of chips, aiming to eliminate the influence of the temperature uniformity effect of bulk diamond and improve the spatial resolution of temperature measurement on the chip surface.