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中国物理学会期刊

应变SiGe SOI量子阱沟道PMOSFET阈值电压模型研究

CSTR: 32037.14.aps.56.3504

Study on threshold voltage model of strained SiGe quantum well channel SOI PMOSFET

CSTR: 32037.14.aps.56.3504
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  • 在绝缘层附着硅(SOI)结构的Si膜上生长SiGe合金制作具有SiGe量子阱沟道的SOI p型金属氧化物半导体场效应晶体管(PMOSFET),该器件不仅具有SOI结构的优点,而且因量子阱中载流子迁移率高,所以进一步提高了器件的性能.在分析常规的Si SOI MOSFET基础上,建立了应变SiGe SOI 量子阱沟道PMOSFET的阈值电压模型和电流-电压(I-V)特性模型,利用Matlab对该结构器件的I-V特性、跨导及漏导特性进行了模拟分析,且与常规结构的器件作了对比.模拟结果表明,应变SiGe SOI量子阱沟道PMOSFET的性能均比常规结构的器件有大幅度提高.

     

    A SOI PMOSFET with SiGe quantum well channel was formed by growing the SiGe film on the Si SOI structure. Not only does the device have the advantage of SOI structure, but also the performance of the device is improved because the carrier mobility in SiGe quantum well is much higher than that in Si. In this paper, the threshold voltage model of strained SiGe SOI quantum well channel PMOSFET is established on the basis of general Si SOI MOSFET, also the model of voltage-current characterisfic is founded. The characteristic of voltage-current, transconductance and leak conductance were simulated and analyzed using MATLAB. The results of the simulation confirm that the strained SiGe SOI quantum well channel PMOSFET performs much better than the conventional PMOSFET.

     

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