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针对削弱暗计数噪声对单光子雪崩二极管(single-photon avalanche diode, SPAD)探测器的影响, 本文研究了采用多晶硅场板降低SPAD器件暗计数率(dark count rate, DCR)的机理和方法. 基于0.18-μm 标准CMOS工艺, 在一种可缩小的P+/P阱/深N阱器件结构的P+有源区和浅沟道隔离区(shallow trench isolation, STI)之间淀积了一层多晶硅场板来减小器件暗计数噪声. 测试结果表明, 多晶硅场板的淀积使SPAD器件的DCR降低了一个数量级, 其在高温下的暗计数性能甚至优于室温下的未淀积多晶硅场板的器件. 通过TCAD仿真进一步发现, SPAD器件保护环区域的峰值电场被多晶硅场板引入到STI内部, 保护环区域的整体电场降低了25%; 最后通过对DCR的建模计算得出, 多晶硅场板削弱了具有高缺陷密度的保护环区域的电场, 使缺陷相关DCR显著降低, 从而有效改善了SPAD的暗计数性能.To suppress the effect of dark count noise on single photon avalanche diode (SPAD) detector, the mechanism and method of reducing the dark count rate (DCR) of SPAD device by using a polysilicon field plate is studied in this paper. Based on the 0.18-μm standard CMOS process, a polysilicon field plate located between the P+ active region and shallow trench isolation (STI) is deposited to reduce the dark count noise for a scaleable P+/P-well/deep N-well SPAD structure. Test results show that the DCR of SPAD device decreases by an order of magnitude after the deposition of polysilicon field plates, and its dark count performance at high temperature is even better than that of device without polysilicon field plate at room temperature. The TCAD simulation further indicates that the peak electric field in the guard ring region of the SPAD device is introduced into the STI by the field plate, and the overall electric field in the guard ring region is reduced by 25%. Finally, through modeling and calculating the DCR, the polysilicon field plate weakens the electric field of the guard ring region with high trap density, hence the trap-related DCR is significantly reduced. Therefore, the dark count performance of SPAD detector is effectively improved.
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Keywords:
- single-photon avalanche diode (SPAD) /
- dark count rate (DCR) /
- polysilicon field plate /
- trap-assisted tunneling (TAT)








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