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中国物理学会期刊

二维材料热传导研究进展

CSTR: 32037.14.aps.69.20200709

Recent progresses of thermal conduction in two-dimensional materials

CSTR: 32037.14.aps.69.20200709
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  • 以石墨烯和氮化硼为代表的二维材料为研究低维体系热传导及其相关界面热阻提供了一个绝佳的平台. 近年的研究表明, 二维材料热导率有着丰富的物理图像, 如长度效应、维度效应、同位素效应及各向异性等. 本文详细综述近十年来二维材料在热传导方面的研究进展. 首先简述二维材料热传导测量技术的原理及发展, 如热桥法、电子束自加热法、时域热反射法及拉曼法等; 其次, 介绍二维材料热传导及界面热阻的实验研究进展, 讨论其相关物理问题; 最后, 介绍二维材料在散热应用方面的研究进展, 并进行总结、指出存在的问题及进一步展望二维材料未来在散热领域的研究方向与前景.

     

    The two-dimensional (2D) materials represented by graphene and boron nitride provide an excellent platform for the study of thermal conduction and the interfacial thermal resistance in low-dimensional system. Recent studies recover exotic physics behind the novel thermal transport properties of 2D materials, such as length effect, dimensional effect, isotopic effect, anisotropic effect, etc. In this review, we introduce the recent progress of thermal properties in 2D materials in the last decade. The principle and development of thermal conduction measurement technologies used in 2D materials are introduced, followed by the experimental progress of thermal conduction and interfacial thermal resistance. Special attention is paid to the abnormal thermal transport and relevant physical problems. Finally, we present thermal management and heat dissipation in 2D electronic devices, summarize and point out the problems and bottlenecks, and forecast the future research directions and foregrounds.

     

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