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中国物理学会期刊

表界面调控米级二维单晶原子制造

CSTR: 32037.14.aps.71.20212399

Atomic-scale manufacture of metre-sized two-dimensional single crystals by interfacial modulation

CSTR: 32037.14.aps.71.20212399
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  • 随着芯片尺寸不断缩小, 短沟道效应、热效应日趋显著. 开发全新的量子材料体系以实现高性能芯片器件应用已成为当前科技发展的迫切需求. 二维材料作为一类重要的量子材料, 其天然具备原子层厚度和平面结构, 能够有效克服短沟道效应并兼容当代微纳加工工艺, 非常有望应用于新一代高性能器件方向. 与硅基芯片发展类似, 二维材料芯片级器件应用必须基于高质量、大尺寸的二维单晶材料制造. 然而, 由于二维材料的表界面特性, 现有体单晶制备技术不能完全适用于单原子层结构的二维单晶制造. 因此, 亟需发展新的制备策略以实现大尺寸、高质量的二维单晶原子制造. 有鉴于此, 本文重点综述表界面调控二维单晶大尺寸制备技术发展现状, 总结梳理了米级二维单晶原子制造过程中的3个关键调控方向, 即单畴生长调控、单晶衬底制备和多畴取向控制. 最后, 系统展望了大尺寸二维单晶在未来规模化芯片器件方向的潜在应用前景.

     

    With the shrinkage of the chip feature size, the short-channel effect becomes more and more predominate. The development of new quantum materials for high-performance devices has become imperative for the current technological development. Two-dimensional (2D) materials, due to their excellent physical and chemical properties, are thought to be the promising candidate of quantum materials for achieving the high-end electronic and optoelectronic devices. Like the development of silicon-based chips, the wafer-scale device applications of 2D materials must be based on the fabrication of high-quality, large-size 2D single crystals. However, the existing manufacturing techniques of the well-studied bulk single crystals cannot be fully applied to the fabrication of 2D single crystals due to the interfacial characteristics of 2D materials. So far, single crystals of metre-sized graphene, decimetre-sized hBN and wafer-sized TMDCs have been successfully prepared by chemical vapor deposition, but the sizes of other 2D single crystals are still very limited and not in the same league as conventional semiconductor materials. Therefore, it is urgent to develop an effective preparation strategy for the manufacture of various 2D single crystals. In this review, we mainly overview the fabrication techniques for the meter-scale growth of 2D single crystals, and propose three key modulation aspects in the atomic-scale manufacture, i.e. the growth modulation of 2D single nucleus, the preparation of single-crystal substrates, and the alignment control of 2D single-crystal domains, in order to provide a universal method of fabricating the large-size 2D single crystals. Finally, the prospect of chip devices based on these high-quality large-size novel 2D single crystals is discussed, thereby paving the way for the future industrial applications of electronics and optoelectronics.

     

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