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中国物理学会期刊

1 nm Al 插入层调节 NiGe/n-Ge 肖特基势垒

CSTR: 32037.14.aps.71.20220320

Effects of ultra-thin aluminium interlayer on Schottky barrier parameters of NiGe/n-type Ge Schottky barrier diode

CSTR: 32037.14.aps.71.20220320
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  • 通过引入1 nm铝作为插入层, 研究了铝在调制镍与n型锗反应时对镍化锗与n型锗接触的肖特基势垒高度的影响. 采用正向 I-V 法、Cheung 法和 Norde 法分别提取了镍化锗与n型锗接触的肖特基二极管的串联电阻、势垒高度和理想因子. 研究表明, 在镍和锗衬底之间引入1 nm铝插入层, 能够有效降低势垒高度, 且其能够在 350 ℃—450 ℃ 保持稳定.

     

    NiGe/n-Ge Schottky barrier height is modulated by Ni/n-Ge reaction with 1 nm Al as an intermediate layer. The series resistance, barrier height and ideal factor of Schottky diodes are extracted by the forward I-V method, Cheung method and Norde method, respectively. Comparing with Ni/n-Ge SBD, the introduction of 1 nm Al insertion layer between Ni and Ge substrates can effectively reduce the barrier height and maintain stability between 350 ℃ and 450 ℃.

     

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