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中国物理学会期刊

快重离子辐照下氮化镓微观损伤机制的速度效应研究

Velocity effect on microscopic damage mechanisms of gallium nitride under swift heavy ion irradiation

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  • 本文采用双温模型耦合分子动力学的多尺度模拟方法,系统探究了快重离子速度效应对氮化镓(GaN)辐照损伤的微观影响机制。结果表明,在相近电子能损条件下,入射离子速度越低,更为局域化的能量沉积造成的晶格损伤程度越严重。以Ta离子辐照为例,当入射速度由6.47 MeV/u降至2.71 MeV/u时,由N2气泡构成的连续柱状离子径迹更加显著,非晶核心区半径由2.21 nm扩大至2.46 nm,径迹中心N2气泡的最大直径由3.2 nm增至3.6 nm。此外,离子径迹周围伴生的大量富镓缺氮的亚稳态闪锌矿相GaN纳米域,以及与之呈现强烈空间关联性的螺位错网络,两者密度均发生明显上升。这种由低速离子引发的高密度微观缺陷可能会提升垂直漏电通道的形成概率,进而成为加剧GaN器件单粒子烧毁风险的重要潜在因素。本研究为理解快重离子辐照下GaN器件的电学性能退化机理与抗辐射加固设计提供了重要的理论依据与数据支撑。

     

    This study employs a multiscale simulation method coupling the two-temperature model with molecular dynamics to systematically investigate the microscopic mechanisms underlying the swift heavy ion (SHI) velocity effect on irradiation damage in gallium nitride (GaN). The simulations describe the coupled energy transfer between the electronic and lattice subsystems on the femtosecond timescale, together with transient lattice melting, recrystallization, and microscopic defect evolution on the atomic scale. The results indicate that, under similar electronic energy loss conditions, a lower incident ion velocity leads to highly localized energy deposition and consequently more severe lattice damage. Taking Ta ion irradiation as an example, when the incident velocity decreases from 6.47 MeV/u to 2.71 MeV/u, the continuous ion tracks composed of N2 bubbles become more pronounced. Specifically, the radius of the amorphous core expands from 2.21 nm to 2.46 nm, and the maximum diameter of the central N2 bubbles enlarges from 3.2 nm to 3.6 nm. Meanwhile, N2 molecules linear density rises from 8.25×108 cm-1 to 11.37×108 cm-1, indicating that low-velocity ions induce more severe decomposition of the wurtzite GaN lattice. Furthermore, there is a proliferation in the densities of both the abundant Ga-rich and N-deficient metastable zincblende GaN nanodomains generated around the ion tracks and the screw dislocation networks that exhibit a strong spatial correlation with them. The high density of microscopic defects induced by low-velocity ions could elevate the probability of forming vertical leakage channels, thus serving as a critical potential factor that exacerbates the risk of single-event burnout in GaN devices. This study provides an essential theoretical basis and data support for understanding the electrical performance degradation mechanisms of GaN devices under SHI irradiation and for advancing radiation-hardening designs.

     

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