Electrothermal coupling analysis of three-dimensional integrated microsystem based on dual cell method

Cao Ming-Peng; Wu Xiao-Peng; Guan Hong-Shan; Shan Guang-Bao; Zhou Bin; Yang Li-Hong; Yang Yin-Tang

doi:10.7498/aps.70.20201628

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Cao Ming-Peng, Wu Xiao-Peng, Guan Hong-Shan, Shan Guang-Bao, Zhou Bin, Yang Li-Hong, Yang Yin-Tang. Electrothermal coupling analysis of three-dimensional integrated microsystem based on dual cell methodJ. Acta Physica Sinica, 2021, 70(7): 074401. DOI: 10.7498/aps.70.20201628

Citation:

Cao Ming-Peng, Wu Xiao-Peng, Guan Hong-Shan, Shan Guang-Bao, Zhou Bin, Yang Li-Hong, Yang Yin-Tang. Electrothermal coupling analysis of three-dimensional integrated microsystem based on dual cell methodJ. Acta Physica Sinica, 2021, 70(7): 074401. DOI: 10.7498/aps.70.20201628

Citation:

Cao Ming-Peng, Wu Xiao-Peng, Guan Hong-Shan, Shan Guang-Bao, Zhou Bin, Yang Li-Hong, Yang Yin-Tang. Electrothermal coupling analysis of three-dimensional integrated microsystem based on dual cell methodJ. Acta Physica Sinica, 2021, 70(7): 074401. DOI: 10.7498/aps.70.20201628