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中国物理学会期刊

GaN基半导体在改变钙钛矿太阳能电池性能方面的理论分析

CSTR: 32037.14.aps.72.20230100

Theoretical analysis of GaN-based semiconductor in changing performanc of perovskite solar cell

CSTR: 32037.14.aps.72.20230100
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  • GaN基半导体在光电子、电子器件已具有重要应用, 如何结合其良好的电学特性进行其他应用方面的理论或实验探索, 是当前新的研究课题. 本文利用 SCAPS-1D软件从理论上计算了GaN在FTO/GaN/ (FAPbI3)0.85(MAPbBr3)0.15/HTL电池结构中电子传输的理论机制. 结果表明, 引入GaN后, 电池的开路电压, 转换效率明显提高. 通过进一步分析准费米能级分裂、界面电场、界面复合率、耗尽层厚度等因素的变化规律, 分析了GaN的厚度和掺杂浓度对电池开路电压等器件参数的影响, 并从GaN作为电子传输层的物理机制方面进行了讨论.

     

    GaN-based semiconductor has been used in optoelectronics and electronic devices. It is a new research topic at present that how its good electrical properties are integrated together to explore other applications in theory or experiment. In this work, SCAPS-1D software is used to calculate the mechanism of GaN electron transport in an FTO/GaN/(FAPbI3)0.85(MAPbBr3)0.15/HTL perovskite solar cell (PSC) structure. The results show that when GaN is used in PSC, the Voc increases from 0.78 V to 1.21 V, PCE increases from 15.87% to 24.18%, and that the small conduction band cliff formed between GaN and the active layer can improve the efficiency of the cell. Quasi-Fermi level splitting, interfacial electric field, interfacial recombination rate and depletion zone thickness at different doping concentrations s are analyzed. The influences of GaN thickness and doping concentration on open-circuit voltage and other device parameters are investigated. The physical mechanism of GaN as an electron transport layer is discussed. With the increase of the thickness, the Jsc of this solar cell decreases gradually, but the change range is not large (24.13—23.83 mA/cm2). The Voc decreases from 1.30 V to 1.21 V when the thickness of GaN exceeds 100nm, and then keeps stable. The power conversion efficiency changing regularity appears in the form of “pits” —first decreases, then increases, and finally keeps stable, with the highest efficiency being 24.76% and the corresponding GaN thickness being 245 nm. The FF shows a trend, which is first decreasing, then increasing, and finally leveling off. In the case of the doping concentration and thickness change at the same time, during the increase of doping concentration, the Jsc decreases gradually with the increase of thickness, but the overall change range is small, and the open-circuit voltage, filling factor and conversion efficiency all show “pits” changes. When the thickness of GaN is 200 nm, with the concentration of GaN doping increasing, the quasi Fermi level splitting increases, and the strength of the built-in electric field between the active layer and the GaN layer increases, thus providing a greater driving force for carrier separation, resulting in a larger potential difference Δμ, and thus a larger Voc. With the increase of doping concentration, the recombination rate of the active layer/GaN layer interface and the recombination rate inside the active layer increase, which leads the value of Jsc to decrease. It is found that the position of the “concave point” of Voc under the change of GaN thickness is determined by varying the GaN doping concentration, the width of GaN depletion region between GaN/FTO, and the width of GaN depletion region between GaN/active layer determine the width of the whole “pit”. In summary, the cell parameters can be improved by simultaneously changing the thickness and doping concentration of GaN.

     

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