MICROWAVE JOINING OF THE Bi-BASED 2223 SUPERCONDUCTOR AND ITS MICROSTRUCTURE FEATURES

CAI JIE; XIE XIAO-MING; LI XIANG-TING; CHEN TING-GUO; HUANG XIAO-XIAN; GUO JING-KUN

doi:10.7498/aps.42.1167

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CAI JIE, XIE XIAO-MING, LI XIANG-TING, CHEN TING-GUO, HUANG XIAO-XIAN, GUO JING-KUN. MICROWAVE JOINING OF THE Bi-BASED 2223 SUPERCONDUCTOR AND ITS MICROSTRUCTURE FEATURESJ. Acta Physica Sinica, 1993, 42(7): 1167-1171. DOI: 10.7498/aps.42.1167

Citation:

CAI JIE, XIE XIAO-MING, LI XIANG-TING, CHEN TING-GUO, HUANG XIAO-XIAN, GUO JING-KUN. MICROWAVE JOINING OF THE Bi-BASED 2223 SUPERCONDUCTOR AND ITS MICROSTRUCTURE FEATURESJ. Acta Physica Sinica, 1993, 42(7): 1167-1171. DOI: 10.7498/aps.42.1167

Citation:

CAI JIE, XIE XIAO-MING, LI XIANG-TING, CHEN TING-GUO, HUANG XIAO-XIAN, GUO JING-KUN. MICROWAVE JOINING OF THE Bi-BASED 2223 SUPERCONDUCTOR AND ITS MICROSTRUCTURE FEATURESJ. Acta Physica Sinica, 1993, 42(7): 1167-1171. DOI: 10.7498/aps.42.1167