The effect of via size on the stress migration of Cu interconnects

Wu Zhen-Yu; Yang Yin-Tang; Chai Chang-Chun; Li Yue-Jin; Wang Jia-You; Liu Bin

doi:10.7498/aps.57.3730

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Wu Zhen-Yu, Yang Yin-Tang, Chai Chang-Chun, Li Yue-Jin, Wang Jia-You, Liu Bin. The effect of via size on the stress migration of Cu interconnectsJ. Acta Physica Sinica, 2008, 57(6): 3730-3734. DOI: 10.7498/aps.57.3730

Citation:

Wu Zhen-Yu, Yang Yin-Tang, Chai Chang-Chun, Li Yue-Jin, Wang Jia-You, Liu Bin. The effect of via size on the stress migration of Cu interconnectsJ. Acta Physica Sinica, 2008, 57(6): 3730-3734. DOI: 10.7498/aps.57.3730

Citation:

Wu Zhen-Yu, Yang Yin-Tang, Chai Chang-Chun, Li Yue-Jin, Wang Jia-You, Liu Bin. The effect of via size on the stress migration of Cu interconnectsJ. Acta Physica Sinica, 2008, 57(6): 3730-3734. DOI: 10.7498/aps.57.3730