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中国物理学会期刊
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Zhu Zhang-Ming, Hao Bao-Tian, Qian Li-Bo, Zhong Bo, Yang Yin-Tang. A compact interconnect temperature distribution model considering the via effect and the heat fringing effectJ. Acta Physica Sinica, 2009, 58(10): 7130-7135. DOI: 10.7498/aps.58.7130
Citation: Zhu Zhang-Ming, Hao Bao-Tian, Qian Li-Bo, Zhong Bo, Yang Yin-Tang. A compact interconnect temperature distribution model considering the via effect and the heat fringing effectJ. Acta Physica Sinica, 2009, 58(10): 7130-7135. DOI: 10.7498/aps.58.7130
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A compact interconnect temperature distribution model considering the via effect and the heat fringing effect

Acta Phys. Sin., 2009, 58(10): 7130-7135.
DOI: 10.7498/aps.58.7130
CSTR: 32037.14.aps.58.7130
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