Quantitative analysis on median-time-to-fail of copper interconnect with lose object defects

Zhou Wen; Liu Hong-Xia

doi:10.7498/aps.58.7716

Zhou Wen, Liu Hong-Xia. Quantitative analysis on median-time-to-fail of copper interconnect with lose object defectsJ. Acta Physica Sinica, 2009, 58(11): 7716-7721. DOI: 10.7498/aps.58.7716

Citation:

Zhou Wen, Liu Hong-Xia. Quantitative analysis on median-time-to-fail of copper interconnect with lose object defectsJ. Acta Physica Sinica, 2009, 58(11): 7716-7721. DOI: 10.7498/aps.58.7716

Citation:

Zhou Wen, Liu Hong-Xia. Quantitative analysis on median-time-to-fail of copper interconnect with lose object defectsJ. Acta Physica Sinica, 2009, 58(11): 7716-7721. DOI: 10.7498/aps.58.7716