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中国物理学会期刊
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Yan Na, Wang Wei-Li, Dai Fu-Ping, Wei Bing-Bo. Microstructure formation mechanism of rapidly solidified ternary Co-Cu-Pb monotectic alloysJ. Acta Physica Sinica, 2011, 60(3): 036402. DOI: 10.7498/aps.60.036402
Citation: Yan Na, Wang Wei-Li, Dai Fu-Ping, Wei Bing-Bo. Microstructure formation mechanism of rapidly solidified ternary Co-Cu-Pb monotectic alloysJ. Acta Physica Sinica, 2011, 60(3): 036402. DOI: 10.7498/aps.60.036402
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Microstructure formation mechanism of rapidly solidified ternary Co-Cu-Pb monotectic alloys

Acta Phys. Sin., 2011, 60(3): 036402.
DOI: 10.7498/aps.60.036402
CSTR: 32037.14.aps.60.036402
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