Through-silicon-via-aware interconnect prediction model for 3D integrated circuirt

Qian Li-Bo; Zhu Zhang-Ming; Yang Yin-Tang

doi:10.7498/aps.61.068001

Qian Li-Bo, Zhu Zhang-Ming, Yang Yin-Tang. Through-silicon-via-aware interconnect prediction model for 3D integrated circuirtJ. Acta Physica Sinica, 2012, 61(6): 068001. DOI: 10.7498/aps.61.068001

Citation:

Qian Li-Bo, Zhu Zhang-Ming, Yang Yin-Tang. Through-silicon-via-aware interconnect prediction model for 3D integrated circuirtJ. Acta Physica Sinica, 2012, 61(6): 068001. DOI: 10.7498/aps.61.068001

Citation:

Qian Li-Bo, Zhu Zhang-Ming, Yang Yin-Tang. Through-silicon-via-aware interconnect prediction model for 3D integrated circuirtJ. Acta Physica Sinica, 2012, 61(6): 068001. DOI: 10.7498/aps.61.068001