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Yang Bin-Xin, Ouyang Jie. Simulation of residual stress in viscoelastic mold filling processJ. Acta Physica Sinica, 2012, 61(23): 234602. DOI: 10.7498/aps.61.234602
Citation: Yang Bin-Xin, Ouyang Jie. Simulation of residual stress in viscoelastic mold filling processJ. Acta Physica Sinica, 2012, 61(23): 234602. DOI: 10.7498/aps.61.234602
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Simulation of residual stress in viscoelastic mold filling process

Acta Phys. Sin., 2012, 61(23): 234602.
DOI: 10.7498/aps.61.234602
CSTR: 32037.14.aps.61.234602
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