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中国物理学会期刊
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Wu Zhen-Yu, Dong Si-Wan, Liu Yi, Chai Chang-Chun, Yang Yin-Tang. Resistometric study on electromigration failure in copper interconnectsJ. Acta Physica Sinica, 2012, 61(24): 248501. DOI: 10.7498/aps.61.248501
Citation: Wu Zhen-Yu, Dong Si-Wan, Liu Yi, Chai Chang-Chun, Yang Yin-Tang. Resistometric study on electromigration failure in copper interconnectsJ. Acta Physica Sinica, 2012, 61(24): 248501. DOI: 10.7498/aps.61.248501
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Resistometric study on electromigration failure in copper interconnects

Acta Phys. Sin., 2012, 61(24): 248501.
DOI: 10.7498/aps.61.248501
CSTR: 32037.14.aps.61.248501
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