Effect of CC bond breakage on diamond tool wear in nanometric cutting of silicon

Wang Zhi-Guo; Zhang Peng; Chen Jia-Xuan; Bai Qing-Shun; Liang Ying-Chu

doi:10.7498/aps.64.198104

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Wang Zhi-Guo, Zhang Peng, Chen Jia-Xuan, Bai Qing-Shun, Liang Ying-Chu. Effect of CC bond breakage on diamond tool wear in nanometric cutting of siliconJ. Acta Physica Sinica, 2015, 64(19): 198104. DOI: 10.7498/aps.64.198104

Citation:

Wang Zhi-Guo, Zhang Peng, Chen Jia-Xuan, Bai Qing-Shun, Liang Ying-Chu. Effect of CC bond breakage on diamond tool wear in nanometric cutting of siliconJ. Acta Physica Sinica, 2015, 64(19): 198104. DOI: 10.7498/aps.64.198104

Citation:

Wang Zhi-Guo, Zhang Peng, Chen Jia-Xuan, Bai Qing-Shun, Liang Ying-Chu. Effect of CC bond breakage on diamond tool wear in nanometric cutting of siliconJ. Acta Physica Sinica, 2015, 64(19): 198104. DOI: 10.7498/aps.64.198104