Effect of prior stress-relief on the gliding of indentation dislocations on silicon wafers

Zhao Ze-Gang; Tian Da-Xi; Zhao Jian; Liang Xing-Bo; Ma Xiang-Yang; Yang De-Ren

doi:10.7498/aps.64.208101

Search

x

Zhao Ze-Gang, Tian Da-Xi, Zhao Jian, Liang Xing-Bo, Ma Xiang-Yang, Yang De-Ren. Effect of prior stress-relief on the gliding of indentation dislocations on silicon wafersJ. Acta Physica Sinica, 2015, 64(20): 208101. DOI: 10.7498/aps.64.208101

Citation:

Zhao Ze-Gang, Tian Da-Xi, Zhao Jian, Liang Xing-Bo, Ma Xiang-Yang, Yang De-Ren. Effect of prior stress-relief on the gliding of indentation dislocations on silicon wafersJ. Acta Physica Sinica, 2015, 64(20): 208101. DOI: 10.7498/aps.64.208101

Citation:

Zhao Ze-Gang, Tian Da-Xi, Zhao Jian, Liang Xing-Bo, Ma Xiang-Yang, Yang De-Ren. Effect of prior stress-relief on the gliding of indentation dislocations on silicon wafersJ. Acta Physica Sinica, 2015, 64(20): 208101. DOI: 10.7498/aps.64.208101