In-situ investigation on the growth of Cu-Al intermetallic compounds in Cu wire bonding

Yang Qing-Ling; Tan Yik-Yee; Wu Xing; Sim Kok Swee; Sun Li-Tao

doi:10.7498/aps.64.216804

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Yang Qing-Ling, Tan Yik-Yee, Wu Xing, Sim Kok Swee, Sun Li-Tao. In-situ investigation on the growth of Cu-Al intermetallic compounds in Cu wire bondingJ. Acta Physica Sinica, 2015, 64(21): 216804. DOI: 10.7498/aps.64.216804

Citation:

Yang Qing-Ling, Tan Yik-Yee, Wu Xing, Sim Kok Swee, Sun Li-Tao. In-situ investigation on the growth of Cu-Al intermetallic compounds in Cu wire bondingJ. Acta Physica Sinica, 2015, 64(21): 216804. DOI: 10.7498/aps.64.216804

Citation:

Yang Qing-Ling, Tan Yik-Yee, Wu Xing, Sim Kok Swee, Sun Li-Tao. In-situ investigation on the growth of Cu-Al intermetallic compounds in Cu wire bondingJ. Acta Physica Sinica, 2015, 64(21): 216804. DOI: 10.7498/aps.64.216804