Structural model of InSb IRFPAs including underfill curing process

Zhang Xiao-Ling; Si Le-Fei; Meng Qing-Duan; Lü Yan-Qiu; Si Jun-Jie

doi:10.7498/aps.66.016102

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Zhang Xiao-Ling, Si Le-Fei, Meng Qing-Duan, Lü Yan-Qiu, Si Jun-Jie. Structural model of InSb IRFPAs including underfill curing processJ. Acta Physica Sinica, 2017, 66(1): 016102. DOI: 10.7498/aps.66.016102

Citation:

Zhang Xiao-Ling, Si Le-Fei, Meng Qing-Duan, Lü Yan-Qiu, Si Jun-Jie. Structural model of InSb IRFPAs including underfill curing processJ. Acta Physica Sinica, 2017, 66(1): 016102. DOI: 10.7498/aps.66.016102

Citation:

Zhang Xiao-Ling, Si Le-Fei, Meng Qing-Duan, Lü Yan-Qiu, Si Jun-Jie. Structural model of InSb IRFPAs including underfill curing processJ. Acta Physica Sinica, 2017, 66(1): 016102. DOI: 10.7498/aps.66.016102