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Liu Xu-Xi, Gao Shi-Sen, La Yong-Xiao, Yu Dong-Liang, Liu Wen-Bo. Phase-field simulation of high-temperature corrosion of binary Zr-2.5Sn alloy. Acta Physica Sinica,
2024, 73(14): 148201.
doi: 10.7498/aps.73.20240393
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Liao Yu-Xuan, Shen Wen-Long, Wu Xue-Zhi, La Yong-Xiao, Liu Wen-Bo. Phase-field simulation of sintering process of ceramic composite fuel. Acta Physica Sinica,
2024, 73(21): 210201.
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Ding Zhi-Song, Gao Wei, Wei Jing-Peng, Jin Yao-Hua, Zhao Chen, Yang Wei. Effects of TaC microparticles on structure and properties of micro-arc oxidation coating on Ti-6Al-4V alloy. Acta Physica Sinica,
2022, 71(2): 028102.
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Jiang Yan-Bo, Liu Wen-Bo, Sun Zhi-Peng, La Yong-Xiao, Yun Di. Phase-field simulation of void evolution in UO2 under applied stress. Acta Physica Sinica,
2022, 71(2): 026103.
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Guo Zhen, Zhao Yu-Hong, Sun Yuan-Yang, Zhao Bao-Jun, Tian Xiao-Lin, Hou Hua. Phase field study of effect of Al on Cu-rich precipitates in Fe-Cu-Mn-Al alloys. Acta Physica Sinica,
2021, 70(8): 086401.
doi: 10.7498/aps.70.20201843
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Song Yan, Jiang Hong-Xiang, Zhao Jiu-Zhou, He Jie, Zhang Li-Li, Li Shi-Xin. Numerical simulations of solidification microstructure evolution process for commercial-purity aluminum alloys inoculated by Al-Ti-B refiner. Acta Physica Sinica,
2021, 70(8): 086402.
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Yang Zhao-Xi, Liu Wen-Bo, Zhang Cong-Yu, He Xin-Fu, Sun Zheng-Yang, Jia Li-Xia, Shi Tian-Tian, Yun Di. Phase field simulation of grain boundary segregation and radiation-enhanced segregation in Fe-Cr alloys. Acta Physica Sinica,
2021, 70(11): 116101.
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Yang Yi-Bo, Zhao Yu-Hong, Tian Xiao-Lin, Hou Hua. Microscopic phase-field simulation for precipitation process of Ni60Al20V20 medium entropy alloy. Acta Physica Sinica,
2020, 69(14): 140201.
doi: 10.7498/aps.69.20200154
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Liu Di, Wang Jing, Wang Jun-Sheng, Huang Hou-Bing. Phase field simulation of misfit strain manipulating domain structure and ferroelectric properties in PbZr(1–x)TixO3 thin films. Acta Physica Sinica,
2020, 69(12): 127801.
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Duan Pei-Pei, Xing Hui, Chen Zhi, Hao Guan-Hua, Wang Bi-Han, Jin Ke-Xin. Phase-field modeling of free dendritic growth of magnesium based alloy. Acta Physica Sinica,
2015, 64(6): 060201.
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Yang Liang, Wei Cheng-Yang, Lei Li-Ming, Li Zhen-Xi, Li Sai-Yi. Monte Carlo simulations of microstructure and texture evolution during annealing of a two-phase titanium alloy. Acta Physica Sinica,
2013, 62(18): 186103.
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Du Li-Fei, Zhang Rong, Xing Hui, Zhang Li-Min, Zhang Yang, Liu Lin. Phase-field simulation of solidified microstructure evolution in the presence of lateral constraint. Acta Physica Sinica,
2013, 62(10): 106401.
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Lu Xiao-Yu, Liao Shuang, Ruan Ying, Dai Fu-Ping. Phase constitution and microstructure evolution of rapidly solidified Ti-Cu-Fe alloy. Acta Physica Sinica,
2012, 61(21): 216102.
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Zhang Xian-Gang, Zong Ya-Ping, Wu Yan. A model for releasing of stored energy and microstructure evolution during recrystallization by phase-field simulation. Acta Physica Sinica,
2012, 61(8): 088104.
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Pan Shi-Yan, Zhu Ming-Fang. Quantitative phase-field model for dendritic growth with two-sided diffusion. Acta Physica Sinica,
2012, 61(22): 228102.
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Zhang Jing, Chen Zheng, Wang Yong-Xin, Lu Yan-Li, Huo Jin-Liang, Zhen Hui-Hui, Zhao Yan. Microscopic phase field simulation for the evolution of antisite defect of L12 structure and D022 structure in Ni75Al5.3V19.7 alloy. Acta Physica Sinica,
2009, 58(1): 631-637.
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Yang Yu-Juan, Wang Jin-Cheng, Zhang Yu-Xiang, Zhu Yao-Chan, Yang Gen-Cang. Investigation on the effect of lamellar thickness on three-dimensional lamellar eutectic growth by multi-phase field model. Acta Physica Sinica,
2008, 57(8): 5290-5295.
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Wang Kuang-Fei, Guo Jing-Jie, Mi Guo-Fa, Li Bang-Sheng, Fu Heng-Zhi. Numerical simulation of microstructure evolution during directional solidification of Ti-45at.%Al alloy. Acta Physica Sinica,
2008, 57(5): 3048-3058.
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Zhang Yu-Xiang, Wang Jin-Cheng, Yang Gen-Cang, Zhou Yao-He. Phase-field simulation of the influence of elastic field on microstructure evolution and equilibrium composition of precipitation. Acta Physica Sinica,
2006, 55(5): 2433-2438.
doi: 10.7498/aps.55.2433
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