Wang Hong, Yun Feng, Liu Shuo, Huang Ya-Ping, Wang Yue, Zhang Wei-Han, Wei Zheng-Hong, Ding Wen, Li Yu-Feng, Zhang Ye, Guo Mao-Feng. Effect of wafer bonding and laser liftoff process on residual stress of GaN-based vertical light emitting diode chipsJ. Acta Physica Sinica, 2015, 64(2): 028501. DOI: 10.7498/aps.64.028501
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Citation:
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Wang Hong, Yun Feng, Liu Shuo, Huang Ya-Ping, Wang Yue, Zhang Wei-Han, Wei Zheng-Hong, Ding Wen, Li Yu-Feng, Zhang Ye, Guo Mao-Feng. Effect of wafer bonding and laser liftoff process on residual stress of GaN-based vertical light emitting diode chipsJ. Acta Physica Sinica, 2015, 64(2): 028501. DOI: 10.7498/aps.64.028501
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Wang Hong, Yun Feng, Liu Shuo, Huang Ya-Ping, Wang Yue, Zhang Wei-Han, Wei Zheng-Hong, Ding Wen, Li Yu-Feng, Zhang Ye, Guo Mao-Feng. Effect of wafer bonding and laser liftoff process on residual stress of GaN-based vertical light emitting diode chipsJ. Acta Physica Sinica, 2015, 64(2): 028501. DOI: 10.7498/aps.64.028501
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Citation:
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Wang Hong, Yun Feng, Liu Shuo, Huang Ya-Ping, Wang Yue, Zhang Wei-Han, Wei Zheng-Hong, Ding Wen, Li Yu-Feng, Zhang Ye, Guo Mao-Feng. Effect of wafer bonding and laser liftoff process on residual stress of GaN-based vertical light emitting diode chipsJ. Acta Physica Sinica, 2015, 64(2): 028501. DOI: 10.7498/aps.64.028501
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