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A global model for deep oscillation magnetron sputtering (DOMS) discharge is established to obtain the plasma characteristics in the ionization region. Target voltage and current waveforms obtained with micropulse on-time τon of 2-6 μs and charging voltage of 300-380 V are acquired as an input of the proposed model. The effects of micropulse on-time and charging voltage on the plasma are investigated. At τon = 2 μs, the DOMS plasma density oscillates with the discharge current waveforms. The plasma is mainly composed of Ar+ ions though the ionization fraction of Ar is only 2%. The proportion of Cr+ ions is lower but with relatively higher ionization fraction of 12% and Cr2+ ions are negligible. The peak plasma density increases from 1.34×1018 m-3 at τon = 2 μs to 2.64×1018 m-3 at τon = 3 μs and the metal ionization fraction increases to 20%. Further increasing the on-time leads to minor variation in the peak density and ionization fraction. When the charging voltage increases from 300 V to 380 V at τon = 6 μs, the peak plasma density increases linearly from 2.67×1018 m-3 to 3.90×1018 m-3, and the metal ionization fraction increases from 21% to 28%. Gas rarefaction occurs in the ionization region for DOMS discharge. The gas density oscillates during the initial stage of macropulse and reaches dynamic equilibrium after 5-6 micropulses. The Ar density dynamics show that the main mechanism of Ar consumption is electron impact ionization, followed by electron impact excitation, and the consumption rate caused by sputter wind is about 10% of the electron impact ionization. The typical metal self-sputtering phenomenon of high power impulse magnetron sputtering (HiPIMS) also appears in the discharge of DOMS. The peak value of self-sputtering parameter increases linearly with the peak power density. This suggests the peak power density is one of the important parameters to manipulate the metal self-sputtering process in DOMS discharge. The peak value of self-sputtering parameter is up to 0.20, indicating that a certain degree of metal self-sputtering occurs. The plasma density as well as the ionization fraction of the depositing flux are improved, which relieves the shadowing effect during conventional magnetron sputtering as a result of low ionization degree of sputtered metal.
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Keywords:
- Deep oscillation magnetron sputtering /
- Magnetron plasma /
- Global model /
- Cr target /
- Metal self-sputtering
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