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Highly sensitive broadband terahertz modulator based on MAPbI3/Graphene/Si composite structure

Lai Wei-En Wu Zong-Dong Li Li-Qi Liu Gen Fang Yan-Jun

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Highly sensitive broadband terahertz modulator based on MAPbI3/Graphene/Si composite structure

Lai Wei-En, Wu Zong-Dong, Li Li-Qi, Liu Gen, Fang Yan-Jun
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  • A high-performance silicon-based terahertz modulator is one of the key devices for building an ultrawideband terahertz-fiber hybrid communication system. In this paper, an ultrawideband terahertz modulator with large modulation depth based on a chalcogenide/graphene/silicon (MAPbI3/Graphene/Si) composite structure driven by near-infrared light (NIR) is proposed. The experimental results show that the graphene thin film and the chalcogenide hole transport layer can effectively promote the interfacial charge separation, increase the carrier complex lifetime, significantly enhance the surface conductivity of the device, further modulate the terahertz wave transmission amplitude, and realize the function of the light-controlled terahertz wave modulator under the NIR light drive. The terahertz transmission characteristics of the device are characterized by an 808 nm NIR modulation excitation source, and a large modulation depth of up to 88.3% is achieved in an ultra-wide frequency range of 0.2–2.5 THz and a low power density of 6.1 mW/mm2 driven by NIR light, which is much higher than that of the bare silicon substrate (14.0%), with the significant advantages of high sensitivity, broadband, and large modulation depth. The corresponding semi-analytical device model is established and the experimental results are verified by simulation. The proposed MAPbI3/Graphene composite thin film is effective in enhancing the silicon-based modulator performance and provides a new strategy for the future integration of silicon-based terahertz modulators in NIR terahertz-fiber hybrid communication systems.
      Corresponding author: Lai Wei-En, wnlai@hfut.edu.cn ; Fang Yan-Jun, jkfang@zju.edu.cn
    • Funds: Project supported by the University Synergy Innovation Program of Anhui Province, China (Grant No. GXXT-2022-015) and the National Natural Science Foundation of China (Grant No. 61905058).
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  • 图 1  (a) MAPbI3/Graphene基调制器结构示意图, 左侧为三维示意图, 右侧为侧视图; (b)硅基底上MAPbI3/Graphene复合薄膜的SEM表征图, 左侧为俯视图, 右侧为侧视图; (c) MAPbI3薄膜在波长500—800 nm下的吸收光谱

    Figure 1.  (a) Schematic diagram of MAPbI3/Graphene-based modulator structure; left, 3D schematic; right, side view; (b) SEM characterization of MAPbI3/Graphene composite thin film on silicon substrate; left, top view; right, side view; (c) absorption spectrum of MAPbI3 thin film at the wavelength range of 500–800 nm.

    图 2  (a) MAPbI3/Graphene模型光照示意图; (b) MAPbI3/Graphene复合薄膜加光激励后的能带示意图以及电子-空穴的流动情况

    Figure 2.  (a) Schematic of MAPbI3/Graphene model with light; (b) schematic diagram of energy band of MAPbI3/Graphene composite thin film after adding light excitation and electron-hole flow condition.

    图 3  (a) Graphene/Si调制器和(b) MAPbI3/Graphene/Si调制器的I-V曲线测试示意图; (c) Graphene/Si调制器和(d) MAPbI3/Graphene/Si调制器在光照(红线)和无光照(蓝线)下的I-V测试曲线; (e) Graphene/Si调制器和(f) MAPbI3/Graphene/Si调制器在0.5 V偏压, 15.1 mW功率光激励下的开关响应曲线

    Figure 3.  Schematic diagram of I-V curve test for (a) Graphene/Si modulator and (b) MAPbI3/Graphene/Si modulator; I-V test curves for (c) Graphene/Si modulator and (d) MAPbI3/Graphene/Si modulator under light (red line) and no light (blue line); switching response curves of (e) Graphene/Si modulator and (f) MAPbI3/Graphene/Si modulator under light excitation with 0.5 V bias and 15.1 mW power.

    图 4  在不同功率密度的激光照射下通过(a)裸硅和(b) MAPbI3/Graphene/Si传输的太赫兹脉冲时域波形; 在不同功率密度的激光照射下通过(c)裸硅和(d) MAPbI3/Graphene/Si传输的太赫兹脉冲的归一化透射; 在不同功率密度的激光照射下(e) 裸硅和(f) MAPbI3/Graphene/Si的太赫兹调制深度

    Figure 4.  Time domain waveforms of terahertz pulses transmitted through (a) bare silicon and (b) MAPbI3/Graphene/Si under laser irradiation at different power density; normalized transmission of terahertz pulses transmitted through (c) bare silicon and (d) MAPbI3/Graphene/Si under laser irradiation at different power density; terahertz modulation depth of (e) bare silicon and (f) MAPbI3/Graphene/Si under laser irradiation at different power density.

    图 5  (a) MAPbI3/Graphene/Si复合结构的响应时间测试示意图; (b) 器件的响应时间函数

    Figure 5.  (a) Schematic diagram of response time testing of MAPbI3/Graphene/Si composite structure; (b) response time function of device.

    图 6  (a) 仿真模拟模型示意图; (b) 通过改变模型的电导率来调制太赫兹脉冲的波形

    Figure 6.  (a) Schematic diagram of the simulated model; (b) waveform of modulated terahertz pulse by changing conductivity of model.

    表 1  常见太赫兹调制器性能比较

    Table 1.  Performance comparison of common terahertz modulators.

    MaterialWavelength/nmPower density/(mW·mm–2)Spectral range/THzMD/%Reference
    MAPbI3/Graphene/Si8086.10.2—2.588.3This work
    MAPbI3/SiO2106453.10.1—1.066.2[33]
    MoS2/Si5322.40.2—2.075.0[34]
    Graphene/TiO2/Si80871.30.3—1.788.0[35]
    Silicon nanotip80860.00.1—4.091.6[36]
    MAPbBr3/Si45030.00.2—2.680.0[37]
    CsPbBr3/Si45020.00.23—0.3545.5[38]
    Graphene/Si780159.20.2—2.099.0[29]
    DownLoad: CSV
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    Ma J J, Shrestha R, Adelberg J, Yeh C Y, Hossain Z, Knightly E, Jornet J M, Mittleman D M 2018 Nature 563 89Google Scholar

    [2]

    Kawano Y 2013 Contemp. Phys. 54 143Google Scholar

    [3]

    Yan Z Y, Zhu L G, Meng K, Huang W X, Shi Q W 2022 Trends Biotechnol. 40 816Google Scholar

    [4]

    Smith R A 2021 Appl. Sci. 11 11724Google Scholar

    [5]

    Wang R Q, Xie L J, Hameed S, Wang C, Ying Y B 2018 Carbon 132 42Google Scholar

    [6]

    张真真, 黎华, 曹俊诚 2018 物理学报 67 090702Google Scholar

    Zhang Z Z, Li H, Cao J C 2018 Acta Phys. Sin. 67 090702Google Scholar

    [7]

    Xu G F, Skorobogatiy M 2022 J. Infrared Millim. Terahertz Waves 43 728Google Scholar

    [8]

    Song Q, Chen H, Zhang M, Li L, Yang J B, Yan P G 2021 APL Photonics 6 056103Google Scholar

    [9]

    Shi Z W, Cao X X, Wen Q Y, Wen T L, Yang Q H, Chen Z, Shi W S, Zhang H W 2018 Adv. Opt. Mater. 6 1700620Google Scholar

    [10]

    Kakenov N, Ergoktas M S, Balci O, Kocabas C 2018 2D Mater. 5 035018Google Scholar

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    Zeng H X, Gong S, Wang L, Zhou T C, Zhang Y, Lan F, Cong X, Wang L Y, Song T Y, Zhao Y C, Yang Z Q, Mittleman D M 2022 Nanophotonics 11 415Google Scholar

    [12]

    Wang J, Tian H, Li S, Li L, Guo W P, Zhou Z X 2020 Opt. Lett. 45 1276Google Scholar

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    田伟, 文岐业, 陈智, 杨青慧, 荆玉兰, 张怀武 2015 物理学报 64 028401Google Scholar

    Tian W, Wen Q Y, Chen Z, Yang Q H, Jing Y L, Zhang H W 2015 Acta Phys. Sin. 64 028401Google Scholar

    [14]

    Hochberg M, Baehr J T, Wang G X, Shearn M, Harvard K, Luo J D, Chen B Q, Shi Z W, Lawson R, Sullivan P, Jen K Y A, Dalton L, Scherer A 2006 Nat. Mater. 5 703Google Scholar

    [15]

    Feng T D, Huang W X, Zhu H F, Lu X G, Das S, Shi Q W 2021 ACS Appl. Mater. Inter. 13 10574Google Scholar

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    Feng T D, Hu Y W, Chang X, Wan Xia Huang, Wang D Y, Zhu H F, An T Y, Li W P, Meng K, Lu X G, Roul B, Das S, Deng H, Zaytsev K I, Zhu L G, Shi Q W 2023 ACS Appl. Mater. Inter. 15 7592Google Scholar

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    Ren Z, Xu J Y, Liu J M, Li B L, Zhou C, Sheng Z G 2022 ACS Appl. Mater. Inter. 14 26923Google Scholar

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    [21]

    Zhou R Y, Wang C, Huang Y X, Xu W D, Xie L J, Ying Y B 2020 Opt. Lasers Eng. 133 106147Google Scholar

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    Yoshioka K, Minam Y, Shudo K I, Dao T D, Nagao T, Kitajima M, Takeda J, Katayama I 2015 Nano Lett. 15 1036Google Scholar

    [23]

    Lai W E, Zhu Q, Liu G, Shi G H, Gan Y C, Amini A, Cheng C 2022 J. Phys. D:Appl. Phys. 55 505103Google Scholar

    [24]

    Zhao X L, Lou J, Xu X, Yu Y, Wang G M, Qi J H, Zeng L X, He J, Liang J G, Huang Y D, Zhang D P, Chang C 2022 Adv. Opt. Mater. 10 2102589Google Scholar

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    Zhou Z, Chen Y L, Feng L S 2016 J. Infrared Millim. Terahertz Waves 37 953Google Scholar

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    Qiu Q X, Huang Z M 2021 Adv. Mater. 33 2008126Google Scholar

    [29]

    Weis P, L J, Pomar G, Hoh M, Reinhard B, Brodyansk A, Rahm M 2012 ACS Nano 6 9118Google Scholar

    [30]

    Lai W E, Ge C D, Yuan H, Dong Q F, Yang D R, Fang Y J 2020 Adv. Mater. Technol. 5 1901090Google Scholar

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    Wang K H, Li J S, Yao J Q 2020 J. Infrared Millim. Terahertz Waves 41 557Google Scholar

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    Yang M S, Li T T, Yan X, Liang L J, Yao H Y, Sun Z Q, Li J, Li J, Wei D Q, Wang M, Ye Y X, Song X X, Zhang H T, Yao J Q 2022 ACS Appl. Mater. Inter. 14 2155Google Scholar

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    Wang H X, Ling F R, Luo C Y, Wang C H, Xiao Y R, Chang Z Y, Wu X C, Wang W J, Yao J Q 2022 Opt. Mater. 127 112235Google Scholar

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    Chen S, Fan F, Miao Y P, He X T, Zhang K L, Chang S J 2016 Nanoscale 8 4713Google Scholar

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    Wei M Q, Zhang D N, Li Y P, Zhang L, Jin L C, Wen T L, Bai F M, Zhang H W 2019 Nanoscale Res. Lett. 14 159Google Scholar

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    Mo C, Liu J B, Wei D S, Wu H L, Wen Q Y, Ling D X 2020 Sensors 20 2198Google Scholar

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  • Received Date:  04 April 2023
  • Accepted Date:  17 May 2023
  • Available Online:  02 June 2023
  • Published Online:  05 August 2023

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