Search

Article

x

留言板

尊敬的读者、作者、审稿人, 关于本刊的投稿、审稿、编辑和出版的任何问题, 您可以本页添加留言。我们将尽快给您答复。谢谢您的支持!

姓名
邮箱
手机号码
标题
留言内容
验证码

Microscopic mechanism of void coalescence under shock loading

Deng Xiao-Liang Song Zhen-Fei He Hong-Liang Zhu Wen-Jun Jing Fu-Qian

Microscopic mechanism of void coalescence under shock loading

Deng Xiao-Liang, Song Zhen-Fei, He Hong-Liang, Zhu Wen-Jun, Jing Fu-Qian
PDF
Get Citation
Metrics
  • Abstract views:  3558
  • PDF Downloads:  825
  • Cited By: 0
Publishing process
  • Received Date:  24 October 2008
  • Accepted Date:  15 November 2008
  • Published Online:  20 July 2009

Microscopic mechanism of void coalescence under shock loading

  • 1. (1)中国工程物理研究院流体物理研究所冲击波物理与爆轰物理重点实验室,绵阳 621900; (2)中国工程物理研究院流体物理研究所冲击波物理与爆轰物理重点实验室,绵阳 621900;四川大学物理科学与技术学院,成都 610064

Abstract: The influence of void configuration on void coalescence in single crystal copper under shock loading along [100] direction has been investigated with molecular dynamics (MD) simulation. The results reveal that the voids collapse and grow by means of emission of shear dislocation loops. In the tension stage, the voids first grow independently, then the plastic zone around the voids begin to interact and overlap, leading to the void coalescence. The pattern of void coalescence observed in our simulations coincides with the microscopic experimental results. We calculated for four different configurations, characterized by the angle (θ) formed by shock direction and the line connecting the two centers of voids, and found that among the four configurations,the coalescence of the voids prefers to occur where θ is 60°. Based on the resolved shear stress model around the void, we can clearly explain the simulation results.

Catalog

    /

    返回文章
    返回