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Thermal capacity of nanocrystalline copper at low temperatures

Zhang Hong-Liang Lei Hai-Le Tang Yong-Jian Luo Jiang-Shan Li Kai Deng Xiao-Chen

Thermal capacity of nanocrystalline copper at low temperatures

Zhang Hong-Liang, Lei Hai-Le, Tang Yong-Jian, Luo Jiang-Shan, Li Kai, Deng Xiao-Chen
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  • Received Date:  04 March 2009
  • Accepted Date:  11 May 2009
  • Published Online:  15 January 2010

Thermal capacity of nanocrystalline copper at low temperatures

  • 1. (1)西南科技大学材料科学与工程学院,绵阳 621010;中国工程物理研究院激光聚变研究中心,绵阳 621900; (2)中国工程物理研究院激光聚变研究中心,绵阳 621900

Abstract: Copper nanoparticles with average diameter of about 45 nm were compressed in a high-strength mold under different pressures at 523 K to produce nanocrystalline copper. The X-ray diffraction (XRD), scanning electron microscopy (SEM),and physics-property-measurement system (PPMS) were used to study the thermal capacity of nanocrystalline Cu as a function of temperature and the mass density at low temperatures. The experimental results indicate that the thermal capacity at low temperatures increases with decreasing density. The thermal capacity of nanocrystalline Cu is higher than that of the coarsed Cu and the increase ratio reaches maximum at around 10 K. The physical mechanism of the phenomenon is explored in this paper.

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