An analytical thermal model for 3D integrated circuit considering through silicon via
Acta Physica Sinica
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Acta Phys. Sin.  2011, Vol. 60 Issue (11): 118001     doi:10.7498/aps.60.0
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An analytical thermal model for 3D integrated circuit considering through silicon via
Zhu Zhang-Ming, Zuo Ping, Yang Yin-Tang
School of Microelectronics, Xidian University, Xi’an 710071, China
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