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有机分子包埋纳米粒子阻变薄膜是信息存储领域的研究热点之一，本文从器件电极、介质层结构、纳米粒子种类、阻变机理和柔性弯折等方面，综述了其近年来的研究进展.电极/分子及分子/纳米粒子界面性质对器件阻变特性影响较大，但影响规律及界面调控机理仍待探究；分子结构与纳米粒子的种类、尺度及分布可改变膜内界面性质进而影响阻变特性；器件阻变机理主要包括导电细丝、电荷俘获与释放和电荷转移三种，其中导电细丝又分金属、氧空位和碳细丝.分子包埋纳米粒子薄膜阻变研究现多停留在小规模和静态器件方面，下一步应从连续卷绕制备、纳米粒子分布精确控制和耐弯扭特性等方面深入研究，为实现大面积、低成本、高柔性阻变存储器奠定基础.Resistive switching of molecular film incorporated with nanoparticles(NPs) has become a hot topic in the information storage industry, which is systematically reviewed from the aspects of electrodes, film structure, NPs, switching mechanism and mechanical properties. There are three sorts of structures i.e., layered, core-shell and complexed films, in which the film thickness affects the device charge transport and switching performance to a large extent. Usually, higher on/off ratio and lower threshold voltage can be expected for device with less-conductive active layers than that with more conductive ones. As a key factor, the interfaces of electrode/organic and molecule/NPs may largely affect the switching performance. It is shown that the type, size and distribution of NPs and molecular structure govern the interfacial behaviors, which in turn influences the switching mechanisms including filament formation/ rupture, charge trapping/ detrapping or charge transfer. For the case of filament theory, it may be ascribed to metallic, oxygen vacant or carbon-rich model. The as-embedded NPs can be classified as metal, metal oxide and/or carbon-like materials such as Au, Ag, Al, ZnO, TiO2, or graphene etc. The Au NPs show distinguishing features of little diameter, high chemical stability and large work function. On the other hand, the metal oxide NPs may form deep interfacial barrier with the target molecules and thus improve the switching characteristics. Small molecular-weight organics are also studied as embedding materials complexed with polymers as to strengthen the switching properties, and charge transfer is believed to be responsible for such an enhancement. Except for concentration and diameter of the NPs, their distribution in the active layer critically influences the memory behavior. The NPs can be made onto the molecular layer in-situ by vacuum thermal evaporation of different metals or sputtering deposition of various metal oxides. In such cases, the thickness of the deposition layer is a key parameter to obtain good switching performance. Although great progress has been made for static devices in small-scale, it is crucial to develop roll-to-roll manufacturing, precise NPs' distribution and dynamic mechanical properties in order to fabricate large-scale, low-cost and flexible memory devices. It still needs hard work on understanding the switching mechanism and engineering the interfacial properties of molecule/electrode and molecule/NPs, especially under bending conditions. New techniques should be developed to fabricate organic memory films embedded with NPs so as to avoid the problems of pinhole, effects of solvent and dust normally existing in traditional spin-coating films.
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Keywords:
- resistive switching /
- organic thin films /
- organic/inorganic interface /
- flexible electronics
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