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The adhesive force between microsurfaces is very important to microelectric mechanical system (MEMS), being always a key factor that detemines the energy dissipation and even the life span. In MEMS, the meniscus force mainly depends on the meniscus shape formed between the contact surfaces. This paper analyzes the meniscus shape changes during the seperation of two microsurfaces. Different meniscus shapes were obtained as a result of different hydrophilic/hydrophobic properties, initial liquid heights and separate distances and so on. The fracture height, the meniscus force value and their change rules in different initial conditions are obtained by numerical simulation, which provides a basis of the MEMS performance analysis and life span calculation.
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Keywords:
- micro-electric mechanical system /
- adhesive force /
- surface energy /
- meniscus force
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[20] Davies J, Haq S, Hanke T, Sargent J P 2009 Int. J. Adhes. Adhes. 29 380
[21] Cai S B, Bhushan B 2007 Nanotechnology 18 465704
[22] Cai S B, Bhushan B 2008 Mater. Sci. Engng. R 61 78
[23] Orr F M, Scriven L E, Rivas A P 1975 J. Fluid Mech. 67 723
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[1] Kim S H, Asy D B, Dugger M T 2007 Nanotoday 2 22
[2] Braun O M, Naumovets A G 2006 Surf. Sci. Rep. 60 79
[3] Zhang C H 2005 Tribol. Int. 38 443
[4] Zhao Y P 2003 Acta Mech. Sin. 19 1
[5] Bhushan B 2007 Microelectron. Engng. 84 387
[6] Qian L M, Luo J B, Wen S Z 2000 Acta Phys. Sin. 49 2247 (in Chinese) [钱林茂、 雒建斌、 温诗铸 2000 物理学报 49 2247]
[7] Cao X P, Jiang Y M 2005 Acta Phys. Sin. 54 2202 (in Chinese) [曹晓平、 蒋亦民 2005 物理学报 54 2202]
[8] Zhang X H, Zhang X J, Liu Y H, Schaefer J A, Wen S Z 2007 Acta Phys. Sin. 56 4722 (in Chinese) [张晓昊、 张向军、 刘永和、 Schaefer J A、 温诗铸 2007 物理学报 56 4722]
[9] Hiratsuka K, Bohno A, Kurosawa M 2001 NATO Sci. Series Ⅱ: Math. Phys. Chem. 10 345
[10] Liu S S, Zhang C H 2009 J. Phys: Conference Series 188 012026
[11] Zhang X J, Dong Y K, Liu Y H, Schaefer J A 2009 Chin. Phys. B 18 0231
[12] Wang S T, Song Y L, Jiang L 2007 J.Photochem.Photobiol. C 8 18
[13] Guo Z G, Fang J, Wang L, Liu W M 2007 Thin Solid Films 515 7190
[14] Sun M H, Luo C X, Xu L P, Ji H, Ouyang Q, Yu D P, Chen Y 2005 Langmuir 21 8978
[15] Nosonovsky M, Bhushan B 2005 Microsyst. Technol. 11 535
[16] Nosonovsky M, Bhushan B 2007 Ultramicroscopy 107 969
[17] Xue W, Zheng B R, Zhang M, Xie G X, Wang Q 2009 Acta Phys. Sin. 58 2518 (in Chinese) [薛 伟、 郑蓓蓉、 张 淼、 解国新、 王 权 2009 物理学报 58 2518]
[18] Guo Z G, Liu W M 2007 Plant Sci. 172 1103
[19] Autumn K, Liang Y A, Hsieh S T, Zesch W, Chan W P, Kenny T W, Fearing R, Full R J 2000 Nature 405 681
[20] Davies J, Haq S, Hanke T, Sargent J P 2009 Int. J. Adhes. Adhes. 29 380
[21] Cai S B, Bhushan B 2007 Nanotechnology 18 465704
[22] Cai S B, Bhushan B 2008 Mater. Sci. Engng. R 61 78
[23] Orr F M, Scriven L E, Rivas A P 1975 J. Fluid Mech. 67 723
[24] Fortes M A 1982 J. Colloid Interface Sci. 88 338
[25] Wei Z, Zhao Y P 2007 J. Phys. D: Appl. Phys. 40 4368
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