4 18 41]单滑移取向铜单晶体在不同塑性应变幅下的疲劳饱和位错结构及其在不同温度等时退火条件下的热稳定性. 结果表明, 在退火温度为300 ℃时, 疲劳位错结构(如脉络结构、驻留滑移带PSB楼梯结构、PSB胞结构和迷宫结构等)均发生了明显回复. 当退火温度高于500 ℃, 上述这些疲劳位错结构基本消失, 均发生了明显的再结晶现象, 并大都伴随有退火孪晶的形成. 分析认为, 再结晶的发生和退火孪晶的出现不仅与退火温度和外加塑性应变幅有关, 还与累积循环塑性应变量有着密切的关系.

"/>         4 18 41] single-slip-oriented Cu single crystal at different values of plastic strain amplitude γpl, as well as their thermal stabilities under annealing at different temperatures for 30 min are studied using the electron channeling contrast (ECC) technique in scanning electron microscopy (SEM). It is found that the dislocation structures, such as veins, PSB ladders, PSB cells, Labyrinths, etc. undergo an obvious process of recovery after annealing at 300 ℃. However, when the annealing temperature is higher than 500 ℃, those dislocation structures basically disappear, and the recrystallization takes place in all specimens, meanwhile, annealing twins form in most cases. The occurrence of the recrystallization and the formation of annealing twins are related not only to the annealing temperature and applied γpl, but also closely to the accumulative cyclic plastic strain.

"/>     一个单滑移取向铜单晶体疲劳位错结构的热稳定性研究
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物理学报  2012, Vol. 61 Issue (15): 156201     doi:10.7498/aps.61.156201
凝聚物质:结构、力学和热学性质 当期目录| 过刊浏览| 高级检索     
一个单滑移取向铜单晶体疲劳位错结构的热稳定性研究
郭巍巍1, 任焕1, 齐成军1, 王小蒙1, 李小武1 2
1. 东北大学理学院材料物理与化学研究所, 沈阳 110004;
2. 东北大学材料各向异性与织构教育部重点实验室, 沈阳 110004
Investigations on the thermal stability of fatigue dislocation structures in a single-slip-oriented copper single crystal
Guo Wei-Wei1, Ren Huan1, Qi Cheng-Jun1, Wang Xiao-Meng1, Li Xiao-Wu1 2
1. Institute of Materials Physics and Chemistry, College of Sciences, Northeastern University, Shenyang 110004, China;
2. Key Laboratory for Anisotropic and Texture of Materials, Ministry of Education, Northeastern University, Shenyang 110004, China

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