双频容性耦合等离子体密度径向均匀性研究

蒋相站; 刘永新; 毕振华; 陆文琪; 王友年

doi:10.7498/aps.61.015204

摘要

利用自主研制的全悬浮双探针, 对影响双频容性耦合等离子体径向均匀性的因素进行了研究. 发现低频功率、放电气压和放电间距对径向均匀性有明显影响. 合适的低频功率、放电气压及较大的极板间距可以得到更均匀的等离子体. 采用与实验相同的放电参数, 利用改进的二维流体模型进行理论模拟, 得到了不同极板间距下径向离子密度分布, 并和实验测量结果进行了比较, 两者的变化趋势基本符合.

关键词:

The influences on dual frequency capacitively coupled plasma radial uniformity are studied with a newly developed complete floating double probe. It is found that low frequency power, discharge pressure and gap have significant effects on radial uniformity. The results show that a suitable low frequency power, discharge pressure and larger discharge gap can achieve more uniform plasma. Finally, the improved two-dimensional fluid model simulations are performed with the same discharge parameters in experiment. The radial ion density distributions are obtained for different discharge gaps. The results are almost consistent with each other.

Keywords:

dual frequency capacitively coupled plasma /
radial uniformity /
complete floating double probe /
improved 2D fluid simulations

作者及机构信息

1.
大连理工大学物理与光电工程学院, 大连 116024;

2.
新疆工业高等专科学校, 乌鲁木齐 830091

基金项目: 国家自然科学基金重点项目(批准号: 10635010)资助的课题.

Authors and contacts

1.
School of Physics and Optoelectronic Technology, Dalian University of Technology, Dalian 116024, China;

2.
Xinjiang Ploytechnical College, Urumqi 830091, China

Funds: Project supported by the Key Program of the National Natural Science Foundation of China (Grant No. 10635010).

参考文献

[1]	Lee J K, Babaeva N Y, Kim H C, Manuilenko O V, Shon JW2004 IEEE Trans. Plasma Sci. 32 47
[2]	Boyle P C, Ellingboe A R, Turner M M 2004 Plasma Sourc. Sci. Technol. 13 493
[3]	Kitajima T, Takeo Y, Petrovic Z L, Makabe T 2000 Appl. Phys. Lett. 77 489
[4]	Kim H C, Lee J K, Shon J W 2003 Phys. Plasmas 10 4545
[5]	Chung T H 2005 Phys. Plasmas 12 104503
[6]	Salabas A, Brinkmann R P 2005 Plasma Sourc. Sci. Technol. 14 S53
[7]	Boyle P C, Ellingboe A R, Turner M M 2004 J. Phys. D: Appl. Phys. 37 697
[8]	Kim H C, Lee J K 2005 Phys. Plasmas 12 053501
[9]	Kim H C, Lee J K 2004 Phys. Rev. Lett. 93 085003
[10]	Kawamura E, Lieberman M A, Lichtenberg A J 2006 Phys. Plasmas 13 053506
[11]	Lee J K, Manuilenko O V, Babaeva N Yu, Kim H C, Shon J W 2005 Plasma Sourc. Sci. Technol. 14 89
[12]	Lowe H D, Goto H H, Ohmi T 1991 J. Vac. Sci. Technol. A 9 3090
[13]	Goto H H, Lowe H D, Ohmi T 1992 J. Vac. Sci. Technol. A 10 3048
[14]	Denda T, Miyoshi Y, Komukai Y, Goto T, Petrovic Z L J, Makabe T 2004 J. Appl. Phys. 95 870
[15]	Karkari S K, Ellingboe A R 2006 Appl. Phys. Lett. 88 101501
[16]	Ohmori T, Goto T K, Kitajima T, Makabe T 2003 Appl. Phys. Lett. 83 4637
[17]	Li X S, Bi Z H, Chang D L, Li Z C 2008 Appl. Phys. Lett. 93 031504
[18]	Li Z C, Chang D L, Li X S, Bi Z H, Lu W Q 2010 Phys. Plasmas 17 033501
[19]	Lisovskiy V A, Yegorenkov V D 2006 Vacuum 80 458
[20]	Sudit I D, Chen F F 1994 Plasma Sourc. Sci. Technol. 3 162
[21]	Braithwaite N S J, Benjamin N M P, Allen J E 1987 J. Phys. E: Sci. Instrum. 20 1046
[22]	Paranjpe A P, McVittie J P, Self S A 1990 J. Appl. Phys. 67 6718
[23]	Hebner G A, Paterson A M 2010 Plasma Sourc. Sci. Technol. 19 015020
[24]	Kitajima T, Takeo Y, Makabe T 1999 J. Vac. Sci. Technol. A 17 2510
[25]	Schulze J, Gans T, O’Connell D, Czarnetzki U, Ellingboe A R, Turner M M 2007 J. Phys. D 40 7008
[26]	Ishimaru M, Ohba T, Ohmori T, Yagisawa T, Kitajima T, Makabe T. 2008 Appl. Phys. Lett. 92 071501
[27]	Chen Z Y, Donnelly V M, Economou D J, Chen L, Funk M, Sundararajan R 2009 J. Vac. Sci. Technol. A 27 1159
[28]	Karkari S K, Ellingboe A R, Gaman C 2008 Appl. Phys. Lett. 93 071501
[29]	Booth J P, Curley G, Mari′c D, Chabert P 2010 Plasma Sourc. Sci. Technol. 19 01500
[30]	Lu W Q (Chinese Patent) 200610134481.0. [2007-06-27] [陆文琪中国专利] 200610134481.0. [2007-06-27]
[31]	Huddlestone R H, Leonard S L 1965 Plasma Diagnostic Techniques (New York: Academic) pp 150, 183
[32]	Zhao G L, Xu Y, Shang J P, Zhu A M, Lu W Q, Wang Y N 2009 Modern Phys. Lett. B 23 3409
[33]	Overzet L J, Hopkins M B 1993 Appl. Phys. Lett. 63 2484
[34]	Lieberman M A, Lichtenberg A J 2007 (Translated by Pa Y K) Principles of Plasma Discharges and Mayeriols Processing (2nd Ed.) (in Chinese) [迈克尔 · A. 力伯曼, 阿伦 · J. 里登伯格著, 蒲以康等译 2007 等离子体放电原理与材料处理 (北京: 科学出版社) p 291]
[35]	Gogolides E, Sawin H H 1992 J. Appl. Phys. 72 3971
[36]	Bukowski J D, Graves D B, Vitello P 1996 J. Appl. Phys. 80 2614
[37]	Stewart R A, Vitello P, Graves D B, Jaeger E F, Berry L A 1995 Plasma Sourc. Sci. Technol. 4 36
[38]	Nitschke T E, Graves D B 1994 J. Appl. Phys. 76 5646
[39]	Boeuf J P, Pitchford L C 1995 Phys. Rev. E 51 1376
[40]	Godyak V A, Piejak R B, Alexandrovich BM1992 Plasma Sourc. Sci. Technol. 1 36

施引文献

[1]	Lee J K, Babaeva N Y, Kim H C, Manuilenko O V, Shon JW2004 IEEE Trans. Plasma Sci. 32 47
[2]	Boyle P C, Ellingboe A R, Turner M M 2004 Plasma Sourc. Sci. Technol. 13 493
[3]	Kitajima T, Takeo Y, Petrovic Z L, Makabe T 2000 Appl. Phys. Lett. 77 489
[4]	Kim H C, Lee J K, Shon J W 2003 Phys. Plasmas 10 4545
[5]	Chung T H 2005 Phys. Plasmas 12 104503
[6]	Salabas A, Brinkmann R P 2005 Plasma Sourc. Sci. Technol. 14 S53
[7]	Boyle P C, Ellingboe A R, Turner M M 2004 J. Phys. D: Appl. Phys. 37 697
[8]	Kim H C, Lee J K 2005 Phys. Plasmas 12 053501
[9]	Kim H C, Lee J K 2004 Phys. Rev. Lett. 93 085003
[10]	Kawamura E, Lieberman M A, Lichtenberg A J 2006 Phys. Plasmas 13 053506
[11]	Lee J K, Manuilenko O V, Babaeva N Yu, Kim H C, Shon J W 2005 Plasma Sourc. Sci. Technol. 14 89
[12]	Lowe H D, Goto H H, Ohmi T 1991 J. Vac. Sci. Technol. A 9 3090
[13]	Goto H H, Lowe H D, Ohmi T 1992 J. Vac. Sci. Technol. A 10 3048
[14]	Denda T, Miyoshi Y, Komukai Y, Goto T, Petrovic Z L J, Makabe T 2004 J. Appl. Phys. 95 870
[15]	Karkari S K, Ellingboe A R 2006 Appl. Phys. Lett. 88 101501
[16]	Ohmori T, Goto T K, Kitajima T, Makabe T 2003 Appl. Phys. Lett. 83 4637
[17]	Li X S, Bi Z H, Chang D L, Li Z C 2008 Appl. Phys. Lett. 93 031504
[18]	Li Z C, Chang D L, Li X S, Bi Z H, Lu W Q 2010 Phys. Plasmas 17 033501
[19]	Lisovskiy V A, Yegorenkov V D 2006 Vacuum 80 458
[20]	Sudit I D, Chen F F 1994 Plasma Sourc. Sci. Technol. 3 162
[21]	Braithwaite N S J, Benjamin N M P, Allen J E 1987 J. Phys. E: Sci. Instrum. 20 1046
[22]	Paranjpe A P, McVittie J P, Self S A 1990 J. Appl. Phys. 67 6718
[23]	Hebner G A, Paterson A M 2010 Plasma Sourc. Sci. Technol. 19 015020
[24]	Kitajima T, Takeo Y, Makabe T 1999 J. Vac. Sci. Technol. A 17 2510
[25]	Schulze J, Gans T, O’Connell D, Czarnetzki U, Ellingboe A R, Turner M M 2007 J. Phys. D 40 7008
[26]	Ishimaru M, Ohba T, Ohmori T, Yagisawa T, Kitajima T, Makabe T. 2008 Appl. Phys. Lett. 92 071501
[27]	Chen Z Y, Donnelly V M, Economou D J, Chen L, Funk M, Sundararajan R 2009 J. Vac. Sci. Technol. A 27 1159
[28]	Karkari S K, Ellingboe A R, Gaman C 2008 Appl. Phys. Lett. 93 071501
[29]	Booth J P, Curley G, Mari′c D, Chabert P 2010 Plasma Sourc. Sci. Technol. 19 01500
[30]	Lu W Q (Chinese Patent) 200610134481.0. [2007-06-27] [陆文琪中国专利] 200610134481.0. [2007-06-27]
[31]	Huddlestone R H, Leonard S L 1965 Plasma Diagnostic Techniques (New York: Academic) pp 150, 183
[32]	Zhao G L, Xu Y, Shang J P, Zhu A M, Lu W Q, Wang Y N 2009 Modern Phys. Lett. B 23 3409
[33]	Overzet L J, Hopkins M B 1993 Appl. Phys. Lett. 63 2484
[34]	Lieberman M A, Lichtenberg A J 2007 (Translated by Pa Y K) Principles of Plasma Discharges and Mayeriols Processing (2nd Ed.) (in Chinese) [迈克尔 · A. 力伯曼, 阿伦 · J. 里登伯格著, 蒲以康等译 2007 等离子体放电原理与材料处理 (北京: 科学出版社) p 291]
[35]	Gogolides E, Sawin H H 1992 J. Appl. Phys. 72 3971
[36]	Bukowski J D, Graves D B, Vitello P 1996 J. Appl. Phys. 80 2614
[37]	Stewart R A, Vitello P, Graves D B, Jaeger E F, Berry L A 1995 Plasma Sourc. Sci. Technol. 4 36
[38]	Nitschke T E, Graves D B 1994 J. Appl. Phys. 76 5646
[39]	Boeuf J P, Pitchford L C 1995 Phys. Rev. E 51 1376
[40]	Godyak V A, Piejak R B, Alexandrovich BM1992 Plasma Sourc. Sci. Technol. 1 36

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