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多弧离子镀工艺对TiN/Ti与Cr/Cu界面及微结构的影响

林秀华 刘 新

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多弧离子镀工艺对TiN/Ti与Cr/Cu界面及微结构的影响

林秀华, 刘 新

INFLUENCE OF MULTI-ARC ION PLATING TECHNIQUE ON THE INTERFACE AND MICROSTRUCTURE OF TiN/Ti AND Cr/Cu CONTACT SYSTEM

LIN XIU-HUA, LIU XIN
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  • 用多弧离子镀技术在铜基上电镀Cr/Ni层进行不同工艺条件下多弧离子沉积TiN/Ti实验.借助X射线衍射(XRD)和扫描电子显微镜(SEM)研究了TiN/Ti与Cr/Cu接触界面形成、微结构及其组分与形貌.XRD分析显示,薄膜表面组分包含TiN,Ti2N多晶相外,还包含一些Cr-Ti的金属间化合物等.显然,TiN,Ti2N在表面上已形成.SEM观察指出,在90℃制备的表面膜具有不平整的类枝状结晶结构.随着温度升高至170℃,得到精细TiN/Ti覆盖层表面,XRD峰
    TiN/Ti film was fabricated by deposition on the chromium layer electrodeposited on the copper substrate by means of multi-arc ion plating technique under different conditions.The interface formation,microstructure and constituents,and morphology for TiN/Ti and Cr/Cu contact system are investigated using X-ray diffraction (XRD) and scanning electron microscope (SEM) techniques.The XRD measurements showed that in addition to the TiN,Ti2N multi-crystallized phases,there was a lot of Cr-Ti,intermetallic compounds on the surface of TiN/Ti film.It is evident that the Ti2N phase was formed.The SEM observation indicated that the surface film prepared at 90℃,had a structure similar to the form of branches and an inhomogeneous crystallization had occurred.As the temperature was increased to 170℃,the XRD peak intensity became stronger and a fine TiN/Ti surface was obtained.
    • 基金项目: 福建省自然科学基金(批准号:F99031)及厦门大学化学系固体表面物理化学国家重点实验室资助的课题.
  • [1] 陈锦峰, 朱林繁. 等离子体刻蚀建模中的电子碰撞截面数据. 物理学报, 2024, 73(9): 095201. doi: 10.7498/aps.73.20231598
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出版历程
  • 收稿日期:  2000-05-11
  • 刊出日期:  2000-11-20

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