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可延展柔性无机微纳电子器件原理与研究进展

冯雪 陆炳卫 吴坚 林媛 宋吉舟 宋国锋 黄永刚

可延展柔性无机微纳电子器件原理与研究进展

冯雪, 陆炳卫, 吴坚, 林媛, 宋吉舟, 宋国锋, 黄永刚
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  • 为适应下一代电子产品便携性、形状可变性、人体适用性等方面的进一步需求,近年来基于无机电子材料的可延展柔性电子技术成为全球电子产业界与学术界关注的新焦点. 与有机柔性电子学器件不同,可延展柔性无机电子器件指的是建立在柔性基底上的无机电子组件. 这种具有柔性的集成电路利用力学设计提供大变形,在保持无机脆性电子器件高性能和高可靠性的同时,具备形状可弯曲、可伸缩等柔性性能. 本文综述了近年来无机柔性电子器件的进展,包括力学设计原理、基于界面黏附的转印集成方法以及柔性大变形下的失效机理等,并展望了未来的应用和发展.
    • 基金项目: 国家自然科学基金(批准号:11320101001,10820101048,11222220,10902059,11372272)和清华信息科学与技术国家实验室(筹)资助的课题.
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  • [1]

    Briseno A L, Tseng R J, Ling M M, Falcao E H L, Yang Y, Wudl F, Bao Z 2006 Adv. Mater. 18 2320

    [2]

    Khang D Y, Jiang H Q, Huang Y, Rogers J A 2006 Science 311 208

    [3]

    Reuss R H, Chalamala B R, Moussessian A, Kane M G, Kumar A, Zhang D C, Rogers J A, Hatalis M, Temple D, Moddel G, Eliasson B J, Estes M J, Kunze J, Handy E S, Harmon E S, Salzman D B, Woodall J M, Ashraf Alan M, Murthy J Y, Jacobsen S C, Olivier M, Markus D, Campbell P M, Snow E 2005 IEEE 93 1239

    [4]

    Crone B, Dodabalapur A, Lin Y Y, Filas R W, Bao Z, LaDuca A, Sarpeshkar R, Katz H E, Li W 2000 Nature 403 521

    [5]

    Forrest S R 2004 Nature 428 911

    [6]

    McAlpine M C, Ahmad H, Wang D, Heath J R 2007 Nat. Mater. 6 379

    [7]

    Baca A J, Ahn J H, Sun Y G, Meitl M A, Menard E, Kim H S, Choi W M, Kim D H, Huang Y, Rogers J A 2008 Angew. Chem. Int. Ed. 47 5524

    [8]

    Sekitani T, Noguchi Y, Hata K, Fukushima T, Aida T, Someya T 2008 Science 321 1468

    [9]

    Sekitani T, Nakajima H, Maeda H, Fukushima T, Aida T, Hata K, Someya T 2009 Nat. Mater. 8 494

    [10]

    Guter W, Schone J, Philipps S P, Steiner M, Siefer G, Wekkeli A, Welser E, Oliva E, Bett A W, Dimroth F 2009 Appl. Phys. Lett. 94 223504

    [11]

    Nicholson P G, Castro F A 2010 Nanotechnology 21 492001

    [12]

    Park S, Xiong Y, Kim R H, Elvikis P, Meitl M, Kim D H, Wu J, Yoon J, Yu C J, Liu Z, Huang Y, Hwang K C, Ferreira P, Li X L, Choquette K, Rogers J A 2009 Science 325 977

    [13]

    Kim H S, Brueckner E, Song J, Li Y H, Kim S, Lu C F, Sulkin J, Choquette K, Huang Y H, Nuzzo R G, Rogers J A 2011 Proc. Natl. Acad. Sci. USA 108 10072

    [14]

    Chen G, Craven M, Kim A, Munkholm A, Watanabe S, Camras M, Götz W, Steranka F 2008 Phys. Status.Solidi. A 205 1086

    [15]

    Kim S O, Lee K H, Kim G Y, Seo J H, Kim Y K, Yoon S S 2010 Synth. Met. 160 1259

    [16]

    Kim D H, Ahn J H, Choi W M, Kim H S, Kim T H, Song J, HuangY, Liu Z, Lu C, Rogers J A 2008 Science 320 507

    [17]

    Ko H C, Stoykovich M P, Song J, Malyarchuk V, Choi W M, Yu C J, Geddes J B Ⅲ, Xiao J, Wang S, Huang Y, Rogers J A 2008 Nature 454 748

    [18]

    Kim D H, Viventi J, Amsden J J, Xiao J, Vigeland L, Kim Y S, Blanco J A, Panilaitis B, Frechette E S, Contreras D, Kaplan D L, Omenetto F G, Huang Y, Hwang K C, Zakin M R, Litt B, Rogers J A 2010 Nat. Mater. 9 511

    [19]

    Yeo W H, Kim Y S, Lee J, Ameen A, Shi L, Li M, Wang S, Ma R, Jin S H, Kang Z, Huang Y, Rogers J A 2013 Adv. Mater. 25 2773

    [20]

    Kim D H, Lu N, Ma R, Kim Y S, Kim R H, Wang S, Wu J, Won S M, Tao H, Islam A, Yu K J, Kim T, Chowdhury R, Ying M, Xu L Z, Li M, Chung H J, Keum H, McCormick M, Liu P, Zhang Y W, Omenetto F G, Huang Y, Coleman T, Rogers J A 2011 Science 333 838

    [21]

    Kim D H, Lu N, Ghaffari R, Kim Y S, Lee S P, Xu L Z, Wu J, Kim R H, Song J, Liu Z, Viventi J, Graff B D, Elolampi B, Mansour M, Slepian M J, Huang S, Moss J D, Won S M, Huang Y, Litt B, Rogers J A 2011 Nat. Mater. 10 316

    [22]

    Xu S, Zhang Y H, Cho J, Lee J, Huang X, Jia L, Fan J A, Su Y, Su J, Zhang H, Cheng H, Lu B, Yu C J, Chuang C, Kim T, Song T, Shigeta K, Kang S, Dagdeviren C, Petrov I, Braun P V, Huang Y, Paik U, Rogers J A 2013 Nat. Commun. 2553 1

    [23]

    Chen X, Hutchinson J W 2004 J. Appl. Mech. 71 597

    [24]

    Huang Z Y, Hong W, Suo Z 2005 J. Mech. Phys. Solids 532 101

    [25]

    Li C R, Cao Z X, Chen X 2008 Physics 37 215 (in Chinese) [李超荣, 曹则贤, 陈曦 2008 物理 37 215]

    [26]

    Zhang H W, Hong L, Wang J B 2007 Acta Phys. Sin. 56 1506 (in Chinese) [张洪武, 王磊, 王晋宝 2007 物理学报 56 1506]

    [27]

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    [29]

    Jiang H, Sun Y, Rogers J A, Huang Y 2008 Int. J. Solids. Struct. 45 2014

    [30]

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    [31]

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    [32]

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    [33]

    Meitl M A, Zhu Z T, Kumar V, Lee K J, Feng X, Huang Y, Adesida I, Nuzzo R G, Rogers J A 2006 Nat. Mater. 5 33

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    Kim D H, Song J, Choi W M, Kim H S, Kim R H, Liu Z, Huang Y, Hwang K C, Zhang Y W, Rogers J A 2008 Proc. Natl. Acad. Sci. USA 105 18675

    [35]

    Yoon J, Baca A J, Park S, Paulius E, Geddes J B Ⅲ, Li L, Kim R H, Xiao J, Wang S, Kim T H, Motala M J, Ahn B Y, Duoss E B, Lewis J A, Nuzzo R G, Ferreira P M, Huang Y, Rockett A, Rogers J A 2008 Nat. Mater. 7 907

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    Lee J, Wu J, Shi M, Yoon J, Park S, Li M, Liu Z, Huang Y, Rogers J A 2011 Adv. Mater. 23 986

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    Lee J, Wu J, Ryu J H, Liu Z, Meitl M, Zhang Y W, Huang Y, Rogers J A 2012 Small 8 1851

    [47]

    Menard E, Lee K J, Khang D Y, Nuzzo R G, Rogers J A 2004 Appl. Phys. Lett. 84 5398

    [48]

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    Baca A J, Ahn J H, Sun Y, Meitl M A, Menard E, Kim H S, Choi W M, Kim D H, Huang Y, Rogers J A 2008 Angew. Chem. Int. Ed. 47 5524

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    Hsia K J, Huang Y, Menard E, Park J U, Zhou W, Rogers J A, Fulton J M 2005 Appl. Phys. Lett. 86 154106

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    Huang Y Y, Zhou W X, Hsia K J, Menard E, Park J U, Rogers J A, Alleyne A G 2005 Langmuir 21 8058

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    Feng X, Meitl M A, Bowen A M, Huang Y, Nuzzo R G, Rogers J A 2007 Langmuir 23 12555

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    [54]

    Chang F S C 1960 Trans. Soc. Rheol. 4 75

    [55]

    Yurenka S 1962 J. Appl. Polym. Sci. 61 36

    [56]

    Nicholson D W 1977 Int. J. Fracture. 13 279

    [57]

    Saubesrre E B, Durney C J, Hajdu J, Bastenbeck E 1965 Plating 52 982

    [58]

    Kaeble D H 1960 Trans. Soc. Rheol. 4 45

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    Kaeble D H 1959 Trans. Soc. Rheol. 3 161

    [60]

    Gent A N, Hamed G R 1975 J. Adhes. 7 91

    [61]

    Gardon J L 1963 J. Appl. Polym. Sci. 7 643

    [62]

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    [63]

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    [64]

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    [65]

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    [66]

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    [68]

    Loukis M J, Aravas N 1991 J. Adhes. 35 7

    [69]

    Chen H, Feng X, Huang Y, Huang Y, Rogers J A 2013 J. Mech. Phys. Solids 61 1737

    [70]

    Kim T W, Bhushan B 2008 J. R. Soc. Interface. 5 319

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    Poulard C, Restagno F, Weil R, Leger L 2011 Soft Matter 7 2543

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    Persson B N J 2003 J. Chem. Phys. 118 7614

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    Persson B N J, Gorb S 2003 J. Chem. Phys. 119 11437

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    Ghatak A, Mahadevan L, Chung J Y, Chaudhury M K, Shenoy V 2004 P. Roy. Soc. A-Math. Phy. 460 2725

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    Majumder A, Ghatak A, Sharma A 2007 Science 318 258

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    Arzt E, Gorb S, Spolenak R 2003 Proc. Natl. Acad. Sci. 100 10603

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    Kazayawoko M, Balatinecz J J, Matuana L M 1999 J. Mater. Sci. 34 6189

    [80]

    Gilbert M J, Awaja F, Kelly G L, Fox B L, Brynolf R, Pigram P J 2011 Surf. Interface Anal. 43 856

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    Park S, Ahn J H, Feng X, Wang S, Huang Y, Rogers J A 2008 Adv. Funct. Mater. 18 2673

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  • 收稿日期:  2013-09-25
  • 修回日期:  2013-10-22
  • 刊出日期:  2014-01-05

可延展柔性无机微纳电子器件原理与研究进展

  • 1. 清华大学航天航空学院, 应用力学教育部重点实验室, 北京 100084;
  • 2. 清华大学先进力学与材料中心, 北京 100084;
  • 3. 电子科技大学, 电子薄膜与集成器件国家重点实验室, 成都 610054;
  • 4. 美国迈阿密大学机械与航空工程系, 迈阿密, 佛罗里达 33146;
  • 5. 中科院半导体研究所, 集成光电子学国家重点联合实验室, 北京 100083;
  • 6. 美国西北大学机械工程系, 埃文斯顿, 伊利诺伊 60208
    基金项目: 

    国家自然科学基金(批准号:11320101001,10820101048,11222220,10902059,11372272)和清华信息科学与技术国家实验室(筹)资助的课题.

摘要: 为适应下一代电子产品便携性、形状可变性、人体适用性等方面的进一步需求,近年来基于无机电子材料的可延展柔性电子技术成为全球电子产业界与学术界关注的新焦点. 与有机柔性电子学器件不同,可延展柔性无机电子器件指的是建立在柔性基底上的无机电子组件. 这种具有柔性的集成电路利用力学设计提供大变形,在保持无机脆性电子器件高性能和高可靠性的同时,具备形状可弯曲、可伸缩等柔性性能. 本文综述了近年来无机柔性电子器件的进展,包括力学设计原理、基于界面黏附的转印集成方法以及柔性大变形下的失效机理等,并展望了未来的应用和发展.

English Abstract

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