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考虑温度分布效应的非对称RLC树时钟偏差研究

王增 董刚 杨银堂 李建伟

考虑温度分布效应的非对称RLC树时钟偏差研究

王增, 董刚, 杨银堂, 李建伟
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  • 提出了一种RLC互连树零时钟偏差构建方法.给出了RLC互连温度非均匀分布及其延时的解析公式,并推导计算了最优的零时钟偏差点,所提模型同时考虑了互连温度非均匀分布、电感效应及不对称互连结构对零时钟偏差点的影响.针对65 nm工艺节点对所提模型进行了仿真验证,结果显示,相较于同类模型,最大误差不超过1%.
    • 基金项目: 国家自然科学基金(批准号:60606006),国家杰出青年基金(批准号:60725415)和重点实验室基金(批准号:9140C030102060C0303)资助的课题.
    [1]

    Wang B H, Mazumder P 2009 Design, Automation and Test in Europe Conference and Exhibition London, UK, April 20-24, 2009 p280

    [2]

    Datta B, Burleson W P 2007 IFIP Int. conf. on Very Large Scale Integration Atlanta, USA, October 15-17, 2007 p258-263

    [3]

    Padmanabhan U, Wang J M, Hu J 2008 IEEE Trans. Computer-Aided Design of Integrated Circuit and Systems 27 1385

    [4]

    Ajami H A, Pedram M, Banerjee K 2001 IEEE Int. conf. on custom integrated circuits San Diego, USA, May 7-9, 2001 p233

    [5]

    Ajami A H, Banerjee K, Pedram M 2005 IEEE Trans. Computer-Aided Design of Integrated Circuit and Systems 24 849

    [6]

    Rosenfeld J, Friedman E G 2007 IEEE Trans.Very Large Scale Integration 15 135

    [7]

    Kim S Y, Wong S S 2007 IEEE Trans. Circuits and Systems I-Reg.Papers 54 2001

    [8]

    Jiang Z, Hu S, Hu J, Li Z, Shi W 2006 Proc. Int. Conf. on Computer-Aided Design San Jose, CA, USA, November 5-9, 2006 p553

    [9]

    Shebaita A, Petranovic D, Ismail Y 2007 Proc. Int. Conf. on Computer-Aided Design San Jose, CA, USA, November 5-9, 2007 p686

    [10]

    Roy A, Chowdhury M H 2008 IEEE Int. Symp. on Circuits and Systems Seattle, WA, USA, May 18-21, 2008 p2426

    [11]

    Alioto M, Palumbo G, Poli M 2009 IEEE Trans. 17 278

    [12]

    Zhu Z M, Hao B T, Qian L B, Zhong B, Yang Y T 2009 Acta Phys. Sin. 58 7130 (in Chinese) [朱樟明、郝报田、钱利波、钟 波、杨银堂 2009 物理学报 58 7130 ]

    [13]

    Venkatesan R, Davis J A, Meindl J D 2003 IEEE Trans. Electron Devices 50 1081

    [14]

    Zhou M, Liu W, Sivaprakasam M 2005 IEEE Int. Symp. on Circuits and Systems Kobe, Japan, May 23-26, 2005 p1082

    [15]

    Uyemura J P (Translated by Zhou R D) 2004 Introduction to VLSI circuits and systems (1st ed) (Beijing: Publishing House of Electronics Industry) p447 (in Chinese)

  • [1]

    Wang B H, Mazumder P 2009 Design, Automation and Test in Europe Conference and Exhibition London, UK, April 20-24, 2009 p280

    [2]

    Datta B, Burleson W P 2007 IFIP Int. conf. on Very Large Scale Integration Atlanta, USA, October 15-17, 2007 p258-263

    [3]

    Padmanabhan U, Wang J M, Hu J 2008 IEEE Trans. Computer-Aided Design of Integrated Circuit and Systems 27 1385

    [4]

    Ajami H A, Pedram M, Banerjee K 2001 IEEE Int. conf. on custom integrated circuits San Diego, USA, May 7-9, 2001 p233

    [5]

    Ajami A H, Banerjee K, Pedram M 2005 IEEE Trans. Computer-Aided Design of Integrated Circuit and Systems 24 849

    [6]

    Rosenfeld J, Friedman E G 2007 IEEE Trans.Very Large Scale Integration 15 135

    [7]

    Kim S Y, Wong S S 2007 IEEE Trans. Circuits and Systems I-Reg.Papers 54 2001

    [8]

    Jiang Z, Hu S, Hu J, Li Z, Shi W 2006 Proc. Int. Conf. on Computer-Aided Design San Jose, CA, USA, November 5-9, 2006 p553

    [9]

    Shebaita A, Petranovic D, Ismail Y 2007 Proc. Int. Conf. on Computer-Aided Design San Jose, CA, USA, November 5-9, 2007 p686

    [10]

    Roy A, Chowdhury M H 2008 IEEE Int. Symp. on Circuits and Systems Seattle, WA, USA, May 18-21, 2008 p2426

    [11]

    Alioto M, Palumbo G, Poli M 2009 IEEE Trans. 17 278

    [12]

    Zhu Z M, Hao B T, Qian L B, Zhong B, Yang Y T 2009 Acta Phys. Sin. 58 7130 (in Chinese) [朱樟明、郝报田、钱利波、钟 波、杨银堂 2009 物理学报 58 7130 ]

    [13]

    Venkatesan R, Davis J A, Meindl J D 2003 IEEE Trans. Electron Devices 50 1081

    [14]

    Zhou M, Liu W, Sivaprakasam M 2005 IEEE Int. Symp. on Circuits and Systems Kobe, Japan, May 23-26, 2005 p1082

    [15]

    Uyemura J P (Translated by Zhou R D) 2004 Introduction to VLSI circuits and systems (1st ed) (Beijing: Publishing House of Electronics Industry) p447 (in Chinese)

  • 引用本文:
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  • PDF下载量:  916
  • 被引次数: 0
出版历程
  • 收稿日期:  2009-12-15
  • 修回日期:  2010-02-24
  • 刊出日期:  2010-04-05

考虑温度分布效应的非对称RLC树时钟偏差研究

  • 1. 西安电子科技大学微电子所,宽禁带半导体材料与器件教育部重点实验室,西安 710071
    基金项目: 

    国家自然科学基金(批准号:60606006),国家杰出青年基金(批准号:60725415)和重点实验室基金(批准号:9140C030102060C0303)资助的课题.

摘要: 提出了一种RLC互连树零时钟偏差构建方法.给出了RLC互连温度非均匀分布及其延时的解析公式,并推导计算了最优的零时钟偏差点,所提模型同时考虑了互连温度非均匀分布、电感效应及不对称互连结构对零时钟偏差点的影响.针对65 nm工艺节点对所提模型进行了仿真验证,结果显示,相较于同类模型,最大误差不超过1%.

English Abstract

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