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Zhang Tong-Xin, Wang Zhi-Jun, Wang Li-Lin, Li Jun-Jie, Lin Xin, Wang Jin-Cheng. Orientation determination and manipulation of single ice crystal via unidirectional solidification. Acta Physica Sinica,
2018, 67(19): 196401.
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Fu Min, Wen Shang-Sheng, Xia Yun-Yun, Xiang Chang-Ming, Ma Bing-Xu, Fang Fang. Failure analysis of GaN-based Light-emitting diode with hole vertical structure. Acta Physica Sinica,
2017, 66(4): 048501.
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Dong Gang, Liu Dang, Shi Tao, Yang Yin-Tang. Effects of thermal stress induced by mulitiple through silicon vias on mobility and keep out zone. Acta Physica Sinica,
2015, 64(17): 176601.
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Dong Gang, Wu Wen-Shan, Yang Yin-Tang. Stack-through silicon via dynamic power consumption optimization in three-dimensional integrated circuit. Acta Physica Sinica,
2015, 64(2): 026601.
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Yang Jing, Wu Xue-Cheng, Wu Ying-Chun, Yao Long-Chao, Chen Ling-Hong, Qiu Kun-Zan, Cen Ke-Fa. Study on extending the depth of field in reconstructed image for a micro digital hologram. Acta Physica Sinica,
2015, 64(11): 114209.
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2014, 63(6): 069501.
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2014, 63(10): 104216.
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Tang Yuan-He, Wu Yong. Study on the partial gating smart network camera for controlling strong light intensity based on DSP and liquid crystal. Acta Physica Sinica,
2013, 62(21): 214210.
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2012, 61(6): 068001.
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2012, 61(19): 194204.
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Li Jun-Chang. Focal depth research of digital holographic reconstructed image. Acta Physica Sinica,
2012, 61(13): 134203.
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Zhu Zhang-Ming, Zuo Ping, Yang Yin-Tang. An analytical thermal model for 3D integrated circuit considering through silicon via. Acta Physica Sinica,
2011, 60(11): 118001.
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2009, 58(2): 794-801.
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Wu Zhen-Yu, Yang Yin-Tang, Chai Chang-Chun, Li Yue-Jin, Wang Jia-You, Liu Bin. The effect of via size on the stress migration of Cu interconnects. Acta Physica Sinica,
2008, 57(6): 3730-3734.
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2006, 55(12): 6410-6413.
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2003, 52(5): 1297-1301.
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1988, 37(12): 2057-2061.
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