Fabrication technology of void embedded silicon-on-insulator substrate

Jia Xin; Liu Qiang; Mu Zhi-Qiang; Zhou Hong-Yang; Yu Wen-Jie

doi:10.7498/aps.72.20230198

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Jia Xin, Liu Qiang, Mu Zhi-Qiang, Zhou Hong-Yang, Yu Wen-Jie. Fabrication technology of void embedded silicon-on-insulator substrateJ. Acta Physica Sinica, 2023, 72(12): 127302. DOI: 10.7498/aps.72.20230198

Citation:

Jia Xin, Liu Qiang, Mu Zhi-Qiang, Zhou Hong-Yang, Yu Wen-Jie. Fabrication technology of void embedded silicon-on-insulator substrateJ. Acta Physica Sinica, 2023, 72(12): 127302. DOI: 10.7498/aps.72.20230198

Citation:

Jia Xin, Liu Qiang, Mu Zhi-Qiang, Zhou Hong-Yang, Yu Wen-Jie. Fabrication technology of void embedded silicon-on-insulator substrateJ. Acta Physica Sinica, 2023, 72(12): 127302. DOI: 10.7498/aps.72.20230198