Thermoelectric air disinfection system

Ji Ren-Cai; Peng Gui-Long; Xu Zhen-Wei; Yang Nuo; Hao Qing

doi:10.7498/aps.71.20220757

Abstract

Epidemic viruses seriously affect human health and the normal operation of society, so it is particularly important to effectively kill viruses. In this work, the thermal performance of a thermoelectric air disinfection system are studied. Utilizing the characteristics of semiconductor thermoelectric sheets with both cold and hot ends, the system can increase the air temperature by heating (cound be used in sterilization), and then, reduce the temperature of the air by cooling. The measurement results show that the air temperature can be increased to 80 ℃ first, and then cooled to 35 ℃. The total energy utilization rate of the system can reach up to 1.2. In addition, combined with the measurement results and numerical calculations, the parameters such as the number of thermoelectric element series, input power, air flow, and boundary insulation can be used to analyze their effects on the system performance. The system may have broad potential applications in public health, medical care, and household disinfection.

Keywords:

Authors and contacts

1.
School of Energy and Power Engineering, Huazhong University of Science and Technology, Wuhan 430074, China
2.
Department of Aerospace and Mechanical Engineering, University of Arizona, Tucson, Arizona 85721-0119, United States of America

Corresponding author: Yang Nuo, nuo@hust.edu.cn ; Hao Qing, qinghao@email.arizona.edu

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References

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[37]	杨诺, 郝磬, 季仁才, 定志东 2021 Patent CN112089882 B Yang N, Hao Q, Ji R C Ding Z D 2021 Chinese Patent CN 112 089 882 B (in Chinese)

Cited By

图 1 热电消毒系统结构示意图

Figure 1. Diagram of thermoelectric disinfection system.

DownLoad: Full-Size Img PowerPoint

图 2 实验搭建测量平台实物图　(a)单个半导体制冷片和换热片单元; (b)多级半导体热电片组成通道; (c)测量过程实物图; (d)加厚保温层后测量实物图

Figure 2. Physical diagram of the measurement platform built in the experiment: (a) A single semiconductor refrigeration element and heat exchange element unit; (b) the multi-stage semiconductor thermoelectric element constitutes a channel; (c) the physical diagram of the measurement process; (d) the physical diagram of the measurement after adding the insulation layer.

DownLoad: Full-Size Img PowerPoint

图 3 热电消毒系统数值计算网格模型

Figure 3. Numerical calculation grid model of thermoelectric disinfection system.

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图 4 不同功率下实验测试和计算结果　(a)电压1.3 V时不同位置的空气温度测试和计算; (b)不同功率下计算的温度云图; (c)不同功率下的温度比较; (d)不同功率下的换热量和性能系数

Figure 4. Experimental test and calculation results under different input powers. (a) Temperature measurement and calculation at different positions when the voltage is 1.3 V; (b) cloud diagram of temperature under different power; (c) comparison of temperature under different power; (d) heat exchange and COP under different power.

DownLoad: Full-Size Img PowerPoint

图 5 不同半导体热电片数量工作的影响(电压1.3 V)　(a)温度比较; (b)换热量和性能系数

Figure 5. The effect of the number of different semiconductor thermoelectric sheets (voltage 1.3 V): (a) Comparison of temperature; (b) heat exchange and COP.

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图 6 (a)流量为7.52 L/min温度测试和计算; (b)不同空气流量下的温度云图; (c)不同空气流量下的温度; (d)不同空气流量下的换热量和COP^*

Figure 6. (a) Temperature test and calculation with a flow rate of 7.52 L/min; (b) temperature cloud diagram under different air flow rates; (c) temperature under different air flow rates; (d) heat exchange and COP* under different air flow rates.

DownLoad: Full-Size Img PowerPoint

图 7 (a)流量为8.91 L/min温度测试和计算; (b)保温层加厚前后的温度云图; (c)不同工况下加厚保温层前后的温度对比; (d)不同工况下加厚保温层前后的COP^*对比.

Figure 7. (a) Temperature test and calculation with a flow rate of 8.91 L/min; (b) temperature cloud diagram before and after thickening of the thermal insulation layer; (c) comparison of temperatures before and after thickening the thermal insulation layer under different working conditions; (d) comparison of COP* before and after thickening the thermal insulation layer under different working conditions.

DownLoad: Full-Size Img PowerPoint

图 8 散热量计算　(a)不同工作级数的影响(其他因素是流速0.1 m/s, 电压1.0 V, 保温层厚度1.5 cm); (b)不同电压的影响(其他因素是10级工作, 流速0.1 m/s, 保温层厚度1.5 cm); (c)不同保温厚度的影响(其他因素是10级工作, 流速0.1 m/s); (d)不同流速的影响(其他因素是10级工作, 电压1.0 V, 保温层厚度1.5 cm)

Figure 8. Heat dissipation calculation: (a) Influence of different working stages (other factors are flow velocity 0.1 m/s, voltage 1.0 V, insulation layer thickness 1.5 cm); (b) influence of different voltages (other factors are 10-stage operation, flow velocity 0.1 m/s), the thickness of the insulation layer is 1.5 cm); (c) the influence of different insulation thickness (other factors are 10-level work, the flow rate is 0.1 m/s); (d) the influence of different flow rates (the other factors are 10-level work, the voltage is 1.0 V, The thickness of the insulation layer is 1.5 cm).

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图 9 绝热边界与实际比较　(a)耗功比较; (b)换热量和COP^*比较

Figure 9. Comparison of adiabatic boundaries with reality: (a) Comparison of power consumption; (b) comparison of heat exchange and COP*.

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表 1 仿真模型材料物性

Table 1. Material properties of the simulation model.

材料及部件	热导率/ (W·(m·K)^–1)	密度/ (kg·m^–3)	比热/ (J·(kg·K)^–1)	表面发射率
半导体制冷片	1.5	7700	154	0.9
铝换热片	201	2710	913	0.038
XPS保温泡沫	0.03	25	2376.2	0.1
流体空气	0.0261	1.1614	1006.5	—

DownLoad: CSV

[1]	Baize S, Pannetier D, Oestereich L, Rieger T, Koivogui L, Magassouba N F, Soropogui B, Sow M S, Keïta S, De Clerck H 2014 N. Engl. J. Med. 371 1418 Google Scholar
[2]	Feldmann H, Geisbert T W 2011 The Lancet 377 849 Google Scholar
[3]	Chidlow G, Harnett G, Williams S, Levy A, Speers D, Smith D W 2010 J. Clin. Microbiol. 48 862 Google Scholar
[4]	Hurt A C, Ernest J, Deng Y M, Iannello P, Besselaar T G, Birch C, Buchy P, Chittaganpitch M, Chiu S C, Dwyer D 2009 Antiviral Res. 83 90 Google Scholar
[5]	Ferguson N M, Keeling M J, John Edmunds W, Gani R, Grenfell B T, Anderson R M, Leach S 2003 Nature 425 681 Google Scholar
[6]	Gani R, Leach S 2001 Nature 414 748 Google Scholar
[7]	Control C F D 2011 MMWR Morb. Mortal. Wkly. Rep. 60 1618
[8]	Douek D C, Brenchley J M, Betts M R, Ambrozak D R, Hill B J, Okamoto Y, Casazza J P, Kuruppu J, Kunstman K, Wolinsky S 2002 Nature 417 95 Google Scholar
[9]	Stadler K, Masignani V, Eickmann M, Becker S, Abrignani S, Klenk H-D, Rappuoli R 2003 Nat. Rev. Microbiol. 1 209 Google Scholar
[10]	Fouchier R A, Kuiken T, Schutten M, et al. 2003 Nature 423 240 Google Scholar
[11]	Prather K A, Wang C C, Schooley R T 2020 Science 368 1422 Google Scholar
[12]	Chen N, Zhou M, Dong X, Qu J, Gong F, Han Y, Qiu Y, Wang J, Liu Y, Wei Y 2020 The Lancet 395 507 Google Scholar
[13]	World Health Organization. Coronavirus disease (COVID-19)https://www.who.int/emergencies/diseases/novel-coronavirus-2019 [2022-02-20]
[14]	疫情监测 https://coronavirus.app [2022-02-20] https://coronavirus.app [2022-02-20]
[15]	刘洋, 谢珊珊, 杨凯, 曹巧玲, 田葆萍, 王木根 2017 职业与健康 33 1422 Liu Y, Xie S S, Yang K, Cao Q L, Tian B P, Wang M G 2017 Occupat. Health 33 1422
[16]	Boo Y C 2020 Antioxidants 9 637 Google Scholar
[17]	Narayanan D L, Saladi R N, Fox J L 2010 Int. J. Dermatol. 49 978 Google Scholar
[18]	Yap T F, Liu Z, Shveda R A, Preston D J 2020 Appl. Phys. Lett. 117 060601 Google Scholar
[19]	Burton J, Love H, Richards K, Burton C, Summers S, Pitman J, Easterbrook L, Davies K, Spencer P, Killip M 2021 J. Virol. Methods 290 114087 Google Scholar
[20]	Wang T T, Lien C Z, Liu S, Selvaraj P 2020 MedRxiv 10.1101/2020.04. 29.20085498 [Physics]
[21]	Pastorino B, Touret F, Gilles M, de Lamballerie X, Charrel R N 2020 BioRxiv 10.3390/v12060624 [physics]
[22]	Chin A W, Chu J T, Perera M R, Hui K P, Yen H-L, Chan M C, Peiris M, Poon L L 2020 The Lancet Microbe 1 e10 Google Scholar
[23]	Pratelli A 2008 Vet. J. 177 71 Google Scholar
[24]	Darnell M E, Subbarao K, Feinstone S M, Taylor D R 2004 J. Virol. Methods 121 85 Google Scholar
[25]	Charm S E, Landau S, Williams B, Horowitz B, Prince A M, Pascual D 1992 Vox Sang. 62 12 Google Scholar
[26]	Trancossi M, Carli C, Cannistraro G, Pascoa J, Sharma S 2021 Int. J. Heat Mass Transf. 170 120983 Google Scholar
[27]	Yu L, Peel G K, Cheema F H, Lawrence W S, Bukreyeva N, Jinks C W, Peel J E, Peterson J W, Paessler S, Hourani M 2020 Mater. Today Phys. 15 100249 Google Scholar
[28]	Correia G, Rodrigues L, Da Silva M G, Gonçalves T 2020 Med. Hypotheses 141 109781 Google Scholar
[29]	Rezaei N, Jafari M, Nazari A, Salehi S, Talati F, Torab R, Nejad-Rahim R 2020 AIP Adv. 10 085308 Google Scholar
[30]	Shan X, Zhang H, Liu C, Yu L, Di Y, Zhang X, Dong L, Gan Z 2020 ACS Appl. Mater. Interfaces 12 56579 Google Scholar
[31]	Ji R, Pan T, Peng G, Ma J, Yang N, Hao Q 2021 Mater. Today Phys. 19 100430 Google Scholar
[32]	Simons R, Ellsworth M, Chu R 2005 J. Heat Transfer 127 76 Google Scholar
[33]	Han J, Park J S, Lei C 1985 J. Eng. Gas Turbines Power 107 628 Google Scholar
[34]	Han J, Park J S 1988 Int. J. Heat Mass Transf. 31 183 Google Scholar
[35]	Yang N, Hao Q, Ji R C 2021 Chinese Patent CN 214 746 278 U(in Chinese)[杨诺, 郝馨, 季仁才 2021 中国专利 CN 214 746 278 U]
[36]	Yang N, Hao Q, Ji R C Wang Y P Li Z W 2021 Chinese Patent CN 119 211 14 B(in Chinese)[杨诺, 郝磬, 季仁才, 王云鹏, 李忠炜 2021 Patent CN111921114 B]
[37]	杨诺, 郝磬, 季仁才, 定志东 2021 Patent CN112089882 B Yang N, Hao Q, Ji R C Ding Z D 2021 Chinese Patent CN 112 089 882 B (in Chinese)

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