[1] Zhang J C, Zhou Z G, Yang W B 2006 Computer Eng. Appl. 3493 (in Chinese) [张建臣, 周智刚, 杨文彬 2006计算机工程与应用 34 93]
[2] Bejan A, Tsataronis G, Moran K 1996 Thermal Design and Optimization(New York: John Wiley & Sons Inc) p132
[3] Yu X L, Feng J M, Feng Q K, Wang Q W 2005 Appl. ThermalEng. 25 173
[4] Han N 2000 J. Xidian Univ. 29 24 (in Chinese) [韩宁 2000 西安电子科技大学学报 29 24]
[5] Kim K S, Won M H, Kim J W, Back B J 2003 Appl. Thermal Eng.23 1137
[6] Yu P 2003 J. Eng. Thermophys. 24 87 (in Chinese) [余鹏 2003 工程热物理学报 24 87]
[7] Zhang L, Qu X H, He X B, Duan B H, Ren S B, Qin M L 2008Mater. Sci. Eng. A 489A 285
[8] Oguri K, Arai T 1990 J. Mater. Res. 5 2567
[9] Kading O W, Skurk H, Goodson K E 1994 Appl. Phys. Lett. 651629
[10] Wang J, Liu G C, Wang L D, Deng X L, Xu J 2008 Chin. Phys. B17 3108
[11] Liu D P, Liu Y H, Chen B X 2006 Chin. Phys. 15 575
[12] Xiao J R, Xu H, Guo A M, Wang H Y 2007 Acta Phys. Sin. 561802 (in Chinese) [肖剑荣,徐慧, 郭爱敏, 王焕友 2007 物理学报 56 1802]
[13] Ding X Z, Tay B K, Tan H S, Lau P S, Cheung W Y, Wong S P2001 Surf. Coat. Technol. 138 301
[14] Delplancke-Ogletree M P, Monteiro O R 1997 J. Vac. Sci. Technol.A 15 1943
[15] Li L H, Zhang H Q, Cui X M, Zhang Y H, Xia L F, Ma X X, SunY 2001 Acta Phys. Sin. 50 1549 (in Chinese) [李刘和,张海泉, 崔旭明, 张彦华, 夏立芳, 马欣新, 孙跃 2001 物理学报 50 1549]
[16] Dillon R O, Woollam J, Katkanant V 1984 Phys. Rev. B 29 3482
[17] Das D, Chen K H, Chattopadhyay S, Chen L C 2002 J. Appl. Phys.91 4944
[18] Erdemir A, Bindal C, Fenske G R, Zuiker C, Wilbur P 1996 Surf.Coat. Technol. 86-87 692
[19] Zhang Z Y, Lu X C, Luo J B, Shao T M, Qing T, Zhang C H 2006Chin. Phys. 15 2697
[20] Wang L S 2003 Special Ceramics (Changsha: Central South Universityof Technology Press) 295 (in Chinese) [王零森2003 特种陶瓷 (长沙:中南工业大学出版社) 295]
[21] Shamsa M, Liu W L, Balandin A A 2006 Appl. Phys. Lett. 89161921