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2013, 62(1): 016601.
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2012, 61(1): 018501.
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Yang Xin-An, Li Jian-Qi, Ding Peng, Liu Fa-Min. Microstructure and magnetic properties of the cobalt ions implanted TiO2 films. Acta Physica Sinica,
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Zhu Zhang-Ming, Zhong Bo, Yang Yin-Tang. An accurate Joule heat model of RLC interconnect based on π equivalent circuit. Acta Physica Sinica,
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Zhu Zhang-Ming, Qian Li-Bo, Yang Yin-Tang. A novel interconnect crosstalk RLC analytic model based on the nanometer CMOS technology. Acta Physica Sinica,
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Zhou Wen, Liu Hong-Xia. Quantitative analysis on median-time-to-fail of copper interconnect with lose object defects. Acta Physica Sinica,
2009, 58(11): 7716-7721.
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Zhu Zhang-Ming, Zhong Bo, Hao Bao-Tian, Yang Yin-Tang. A novel temperature-aware distributed interconnect power model. Acta Physica Sinica,
2009, 58(10): 7124-7129.
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Chen Shun-Sheng, Yang Chang-Ping, Deng Heng, Sun Zhi-Gang. Microstructure dependence of the electroresistance of Nd0.7Sr0.3MnO3. Acta Physica Sinica,
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Zhang Wen-Jie, Yi Wan-Bing, Wu Jin. Electromigration in Al interconnects and the challenges in ultra-deep submicron technology. Acta Physica Sinica,
2006, 55(10): 5424-5434.
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Zheng Li-Jing, Li Shu-Suo, Li Huan-Xi, Chen Chang-Qi, Han Ya-Fang, Dong Bao-Zhong. Small angle x-ray scattering study on microstructure and mechanical property evo lutions of equal-channel angular pressed 7050 Al alloy. Acta Physica Sinica,
2005, 54(4): 1665-1670.
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2002, 51(8): 1851-1855.
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2002, 51(1): 115-124.
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2001, 50(1): 139-143.
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