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Like an electric diode, thermal diode transmits heat in a specific direction, and thermal rectification is also a fundamental phenomenon for active heat flow control. However, in practical applications, thermal rectification needs to be operated under transient conditions. In this study, transient thermal rectification ratio of a one-dimensional heterostructure is numerically investigated by using the finite element method. The effects of interface thermal resistance, interface initial gap, periodic boundary condition and geometric and material parameters on the transient thermal resistance ratio are obtained. Research indicates that the interface thermal resistance can enhance the thermal rectification effect of the system, and the introduction of the initial interface gap improves the transient thermal rectification ratio by an order of magnitude. The ability to engineer the thermal diffusivity of materials allows us to control the heat flux and improve transient thermal rectification ratio. Since interface thermal resistance can enlarge the difference in heat transfer capability between forward case and reverse case, it is reasonable to suggest that adjusting the interface thermal resistance may also enhance the thermal rectification effect, but excessive interface thermal resistance will reduce it. Under the periodic temperature boundary conditions, the larger the temperature difference in boundary fluctuation, the larger the fluctuation amplitude of the transient thermal rectification ratio is. The fluctuation frequency of thermal rectification changes with the periodic boundary frequency, which also affects the amplitude of the fluctuation. Furthermore, by adjusting the initial interface gap, the gap is closed during heat transfer and the interface thermal resistance is reduced in the forward case, while the interface gap is kept open in the reverse case, thereby improving the overall thermal rectification ratio by an order of magnitude. For different transient stages, the equivalent thermal conductivity can be changed by adjusting the material and geometrical properties to improve the thermal rectification ratio.Therefore, the proposed numerical approach and results can guide the optimal design of the transient thermal rectifier.
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Keywords:
- transient thermal rectification ratio /
- composite structure /
- interface thermal resistance /
- periodic boundary condition
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图 1 复合结构热整流器模型 (a) 正向温度边界; (b) 反向温度边界
Figure 1. Composite structure thermal rectifier model: (a) Forward case; (b) reverse case.
图 2 不同的界面传热形式
Figure 2. Different forms of interface heat transfer.
图 3 不同界面热阻下的瞬态热整流系数
Figure 3. Transient thermal rectification ratio with different interface thermal resistances.
图 4 周期性变温边界条件下界面热阻对瞬态热整流系数的影响
Figure 4. Effect of interface thermal resistance on transient thermal rectification ratio with periodical temperature boundary conditions.
图 5 不同初始界面间隙下的瞬态热整流系数
Figure 5. Transient thermal rectification ratio with different initial interface gaps.
图 6 初始界面间隙为0.6 mm时热整流器关键参数的瞬态响应 (a) 界面间隙; (b) 界面接触应力; (c) 界面热阻; (d) 低温端热流
Figure 6. Transient response of key parameters in thermal rectifier with 0.6 mm initial interface gap : (a) Interface gap; (b) interface contact stress; (c) interface thermal resistance; (d) heat flux at cold side.
图 7 不同初始界面间隙下热整流系数的瞬态响应
Figure 7. Transient response of thermal rectification ratio at different initial interface gaps.
图 8 不同周期性条件参数
$ \Delta T $ 下的瞬态热整流系数Figure 8. Transient thermal rectification ratio with different periodical condition parameters
$ \Delta T $ .
图 9 不同周期性条件参数
$ \omega $ 和高温边界形式下的瞬态热整流系数Figure 9. Transient thermal rectification ratio with different periodical condition parameters
$ \omega $ and high temperature boundary forms
图 10 不同几何和材料参数对瞬态热整流系数的影响
Figure 10. Effect of geometry parameter and material pair on the transient thermal rectification ratio.
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[1] Starr C 1936 Physics 7 15
Google Scholar
[2] Wong M Y, Tso C Y, Ho T C, Lee H H 2021 Int. J. Heat Mass Transfer 164 120607
Google Scholar
[3] Yang N, Xu X F, Zhang G, Li B W 2012 AIP Adv. 2 041410
Google Scholar
[4] Li B W, Wang L, Casati G L 2004 Phys. Rev. Lett. 93 184301
Google Scholar
[5] Zhu J, Hippalgaonkar K, Shen S, et al. 2014 Nano Lett. 14 4867
Google Scholar
[6] Paolucci F, Marchegiani G, Strambini E, Giazotto F 2018 Phys. Rev. Appl. 10 024003
Google Scholar
[7] Wang J, Shao C R, Li H Y, Xia G D 2022 Int. J. Heat Mass Transfer 188 122627
Google Scholar
[8] Sarkar S, Nefzaoui E, Basset P, Bourouina T 2021 J. Quant. Spectrosc. Radiat. Transfer 266 107573
Google Scholar
[9] Leon-Gil J A, Martinez-Flores J J, Alvarez-Quintana J 2018 J. Mater. Sci. 54 3211
Google Scholar
[10] Go D B, Sen M 2010 J. Heat Transfer 132 124502
Google Scholar
[11] Peyrard M 2006 Europhys. Lett. 76 49
Google Scholar
[12] Dames C 2009 J. Heat Transfer 131 061301
Google Scholar
[13] Kobayashi W, Teraoka Y, Terasaki I 2009 Appl. Phys. Lett. 95 171905
Google Scholar
[14] Yang Y, Chen H Y, Wang H, Li N B, Zhang L F 2018 Phys. Rev. E 98 042131
Google Scholar
[15] Majdi T, Pal S, Puri I K 2017 Int. J. Therm. Sci. 117 260
Google Scholar
[16] Shih T M, Gao Z J, Guo Z Q, Merlitz H, Pagni P J, Chen Z 2015 Sci. Rep. 5 12677
Google Scholar
[17] 邵春瑞, 李海洋, 王军, 夏国栋 2021 物理学报 70 236501
Google Scholar
Shao C R, Li H Y, Wang J, Xia G D 2021 Acta Phys. Sin. 70 236501
Google Scholar
[18] Sawaki D, Kobayashi W, Moritomo Y, Terasaki I 2011 Appl. Phys. Lett. 98 081915
Google Scholar
[19] Tian H, Xie D, Yang Y, Ren T L, Zhang G, Wang Y F, Zhou C J, Peng P G, Wang L G, Liu L T 2012 Sci. Rep. 2 523
Google Scholar
[20] Sadat H, Le Dez V 2016 Mech. Res. Commun. 76 48
Google Scholar
[21] Carlomagno I, Cimmelli V A, Jou D 2020 Mech. Res. Commun. 103 103472
Google Scholar
[22] 赵建宁, 刘冬欢, 魏东, 尚新春 2020 物理学报 69 056501
Google Scholar
Zhao J N, Liu D H, Wei D, Shang X C 2020 Acta Phys. Sin. 69 056501
Google Scholar
[23] 朱玉鑫, 王珏, 罗爽, 王军, 夏国栋 2016 中国科学:技术科学 46 175
Google Scholar
Zhu Y X, Wang J, Luo S, Wang J, Xia G D 2016 Sci. China Ser. E 46 175
Google Scholar
[24] Chumak K, Martynyak R 2012 Int. J. Heat Mass Transfer 55 5603
Google Scholar
[25] Sayer R A 2016 Heat Transfer Res. 47 733
Google Scholar
[26] Carlomagno I, Cimmelli V A, Jou D 2021 J. Therm. Stresses 44 919
Google Scholar
[27] Carlomagno I, Cimmelli V A, Jou D 2020 Phys. Lett. A 384 126905
Google Scholar
[28] Zhao J N, Wei D, Gao A Q, Dong H L, Bao Y B, Jiang Y M, Liu D H 2020 Appl. Therm. Eng. 176 115410
Google Scholar
[29] Zhao J N, Wei D, Dong Y Y, Zhang D, Liu D H 2022 Int. J. Heat Mass Transfer 194 123024
Google Scholar
[30] 单小东, 王沫然 2014 工程热物理学报 35 1401
Google Scholar
Shan X D, Wang M R 2014 J. Eng. Thermophys. 35 1401
Google Scholar
[31] 温家乐, 徐志成, 古宇, 郑冬琴, 钟伟荣 2015 物理学报 64 216501
Google Scholar
Wen J L, Xu Z C, Gu Y, Zheng D Q, Zhong W R 2015 Acta Phys. Sin. 64 216501
Google Scholar
[32] 李威, 冯妍卉, 唐晶晶, 张欣欣 2013 物理学报 62 076106
Google Scholar
Li W, Feng Y H, Tang J J, Zhang X X 2013 Acta Phys. Sin. 62 076106
Google Scholar
[33] 鞠生宏, 梁新刚 2013 物理学报 62 026101
Google Scholar
Ju S H, Liang X G 2013 Acta Phys. Sin. 62 026101
Google Scholar
[34] Herrera F A, Luo T F, Go D B 2017 J. Heat Transfer 139 091301
Google Scholar
[35] Klinar K, Rojo M M, Kutnjak Z, Kitanovski A 2020 J. Appl. Phys. 127 234101
Google Scholar
[36] Ordonez-Miranda J, Guo Y Y, Alvarado-Gil J J, Volz S, Nomura M 2021 Phys. Rev. Appl. 16 L041002
Google Scholar
[37] Zhang G, Cottrill A L, Koman V B, Liu A T, Mahajan S G, Piephoff D E, Strano M S 2020 Appl. Energy 280 115881
Google Scholar
[38] Shimokusu T J, Zhu Q, Rivera N, Wehmeyer G 2022 Int. J. Heat Mass Transfer 182 122035
Google Scholar
[39] Barber J R, Zhang R 1988 Int. J. Mech. Sci. 30 691
Google Scholar
[40] Touloukian Y S, Powell R W, Ho C Y, Klemens P G 1970 Thermophysical Properties of Mmatter-the Tprc Data Series (United States: Purdue University)
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