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环氧树脂纳米复合材料在电气绝缘领域应用广泛，通过引入纳米介质实现复合材料介电、绝缘性能的调控以满足特殊应用需求.本文通过五氟苯乙烯与苯乙烯的共聚，制备了表面氟化的聚苯乙烯纳米微球，并以其为填料制备了环氧树脂复合材料.以纯环氧树脂和填充聚苯乙烯纳米微球环氧复合材料作为参照，研究了三种复合材料的直流电导率、介电特性、交直流击穿场强、空间电荷行为并计算了材料内部的陷阱能级.结果表明：填充氟化聚苯乙烯纳米微球的环氧树脂复合材料表现出优异的电学特性，其电导率以及介电常数大幅下降、同时交直流击穿场强获得提高.相比填充无氟聚苯乙烯纳米微球的环氧树脂，氟化聚苯乙烯纳米微球的引入可降低材料的介电损耗，限制空间电荷的注入，并加深基体中的陷阱能级．研究结果可为环氧树脂复合材料介电性能调控设计以及环氧树脂在电子封装应用提供指导.Epoxy resin nanocomposites are widely used in the field of electronic packaging. It is of great significance to regulate the dielectric and insulation properties of composite materials by introducing nano-filler to meet special application requirements. This paper proposes a chemical copolymerization method, fluorinated polystyrene nanospheres were synthesized through an addition reaction as filler, and finally the epoxy nanocomposites were prepared. The polystyrene nanospheres have a uniform size and good compatibility with the epoxy resin. The introducing of nanospheres reduces the dielectric constant of the epoxy resin composite material and increases the breakdown strength simultaneously. Although the dielectric loss increases, the composites’ imaginary part remains below 0.04 within 1MHz frequency. In particular, the 2wt% fluorinated polystyrene/epoxy composite exhibits a decrease in dielectric constant and DC conductivity, while the AC and DC breakdown strengths increase by 12.6% and 6%, respectively.
The results of the Pulse Electro-acoustic method indicate that the charge injection of the epoxy resin filled with non-fluorinated polystyrene nanospheres is evident, while the introducing of fluorinated nanospheres significantly reduces the charge injection level. Calculations based on the depolarization process reveal that the introducing of fillers leads to an increase in trap density and depth of energy levels in the composites. Notably, the epoxy resin filled with fluorinated fillers has the deepest trap levels, providing an explanation for the improved insulation breakdown performance. The research can provide guidance for the regulation of dielectric properties of epoxy composites and material synthesis for the application of electronic insulation packaging.-
Keywords:
- Epoxy resin /
- PS nanospheres /
- Fluorination /
- Dielectric properties
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