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在微波电路系统中, 电磁波由一种传输介质进入另一种传输介质所带来的不连续性等问题会极大地影响系统的传输性能, 这一直是设计微波电路所要关注的重点问题. 当电磁波频段进入毫米波和太赫兹频段之后, 如何实现电磁波从金属矩形波导接口到介质基板的高效、低损耗传输, 是实现毫米波太赫兹通信系统的关键所在. 本文设计了一种基于低温共烧陶瓷的基片集成波导-矩形波导过渡结构, 通过阶梯渐变结构来改善传输性能、拓展带宽, 并在此基础上设计了用于馈电网络的一分二过渡结构, 引入空腔结构来降低损耗并拓展带宽. 这两种结构都具有结构简单、易于加工的特点, 可在W波段或D波段实现良好的传输特性, 具备一定的频带普适性. 在频率较高的D波段加工制作了测试基板, 测量了其传输特性以验证该结构的实用性, 其测试结果表明: 该基片集成波导过渡结构可在126—149 GHz或112—139 GHz的频带内实现良好的传输特性; 一分二过渡结构可在132—155 GHz的频带内实现良好的传输特性.In a microwave circuit system, the discontinuity caused by electromagnetic wave entering into another transmission medium from one transmission medium will greatly affect the transmission performance of the system, which has always been the focus of microwave circuit design. When the electromagnetic wave band enters into the millimeter wave and terahertz band, how to realize the efficient and low loss transmission of electromagnetic wave from the metal rectangular waveguide interface to the dielectric substrate is the key to the realization of millimeter wave terahertz communication system. Substrate integrated waveguide to rectangular waveguide transition structure is an important structure connecting waveguide interface and planar circuit in millimeter wave and terahertz communication system, and it is the basis of designing planar antenna array. In this paper, a W-band and D-band substrate integrated waveguide to rectangular waveguide transition structure is designed, which improves the transmission performance and expands the bandwidth through the stepped structure. On this basis, a one-in-two divider structure is designed, with an empty cavity structure used to reduce the loss and expand the bandwidth. These two structures have the characteristics of simple structure and easy processing, and their practicalities are verified by simulation optimization and actual low temperature co-fired ceramic substrate processing and assembly test. The actual test results show that the substrate integrated waveguide to rectangular waveguide transition structure can achieve a return loss of less than –10 dB in a frequency ranges of 126–149 GHz and 112–139 GHz, the one-in-two divider structure can achieve a return loss of less than –10 dB in the frequency band of 132–155 GHz.
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Keywords:
- substrate integrated waveguide /
- transition structure /
- millimeter wave-terahertz /
- low temperature co-fired ceramic
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Li H 2005 Ph. D. Dissertation (Nanjing: Southeast University) (in Chinese)
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Pan J 2018 M. S. Dissertation (Chengdu: University of Electronic Science and Technology of China) (in Chinese)
[6] 张帆 2010 硕士学位论文 (长沙: 国防科学技术大学)
Zhang F 2010 M. S. Dissertation (Changsha: National University of Defense Technology) (in Chinese)
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[15] Karki S K, Ala-Laurinaho J, Zheng J, Lahti M, Viikari V 2019 16 th European Radar Conference (EuRAD) Paris Expo Porte de Versailles, France, October 2–4, 2019 pp321–324
[16] Abuzaid H, Doghri A, Wu K, Shamim A 2013 IEEE MTT-S International Microwave Symposium Digest (MTT) Seattle, WA, USA, June 2–7, 2013 pp1–3
[17] Zhang T, Li L, Zhu Z, Cui T J 2019 IEEE Microw. Wirel. Compon. Lett. 29 532Google Scholar
[18] Bu S, Jin H, Wang W, Luo G, Chin K S 2019 IEEE MTT-S International Wireless Symposium (IWS) Guangzhou, China, May 19–22, 2019 pp1–3
[19] Esteban H, Belenguer A, Sánchez J R, Bachiller C, Boria V E 2017 IEEE Microw. Wirel. Compon. Lett. 27 685Google Scholar
[20] Parment F, Ghiotto A, Vuong T P, Carpentier L, Wu K 2017 IEEE MTT-S International Microwave Symposium (IMS) Honololu, HI, USA, June 4–9, 2017 pp719–722
[21] Isapour A, Kouki A 2019 IEEE Trans. Microw. Theory 67 868Google Scholar
[22] Tajima T, Song H, Yaita M 2016 IEEE Trans. Microw. Theory 64 106Google Scholar
[23] Hansen S, Kueppers S, Pohl N 2018 48th European Microwave Conference (EuMC) Madrid, Spain, September 23–27, 2018 pp117–120
[24] 赵发举 2020 硕士学位论文 (成都: 电子科技大学)
Zhao F J 2020 M. S. Dissertation (Chengdu: University of Electronic Science and Technology of China) (in Chinese)
[25] Tran T H, Hirokawa J 2011 International Conference on Advanced Technologies for Communications (ATC 2011) Da Nang, Vietnam, August 2–4, 2011 pp187–190
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[1] Wang J, Hao Z C, Kui-Kui F 2016 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications (IMWS-AMP) Chengdu, China, July 20–22, 2016 pp1–3
[2] Song H J 2017 Proc. IEEE 105 1121Google Scholar
[3] Xu R, Gao S, Izquierdo B S, Gu C, Reynaert P, Standaert A, Gibbons G J, Bösch W, Gadringer M E, Li D 2020 IEEE Access 8 57615Google Scholar
[4] 李皓 2005 博士学位论文 (南京: 东南大学)
Li H 2005 Ph. D. Dissertation (Nanjing: Southeast University) (in Chinese)
[5] 潘俊 2018 硕士学位论文 (成都: 电子科技大学)
Pan J 2018 M. S. Dissertation (Chengdu: University of Electronic Science and Technology of China) (in Chinese)
[6] 张帆 2010 硕士学位论文 (长沙: 国防科学技术大学)
Zhang F 2010 M. S. Dissertation (Changsha: National University of Defense Technology) (in Chinese)
[7] Mohamed I, Sebak A 2018 IEEE Microw. Wirel. Compon. Lett. 28 966Google Scholar
[8] Abdel-Wahab W, Ehsandar A, Al-Saedi H, Safavi-Naeini S 2016 Electron. Lett. 52 1465Google Scholar
[9] Abdel-Wahab W M, Safavi-Naeini S 2019 IEEE International Symposium on Antennas and Propagation and USNC-URSI Radio Science Meeting Atlanta, Georgia, USA, July 7–12, 2019 pp963–964
[10] Li Y, Luk K 2014 IEEE Microw. Wirel. Compon. Lett. 24 590Google Scholar
[11] Zhang D, Xu Z, Xiao Y, Sun H 2017 Sixth Asia-Pacific Conference on Antennas and Propagation (APCAP) Xi’an, China, October 16–19 2017 pp1–3
[12] Dai X 2016 IEEE Microw. Wirel. Compon. Lett. 26 897Google Scholar
[13] Cao B, Wang H, Huang Y, Wang J, Sheng W 2013 IEEE Microw. Wirel. Compon. Lett. 23 572Google Scholar
[14] Hansen S, Pohl N 2019 49th European Microwave Conference (EuMC) Paris, France, October 1–3, 2019 pp352–355
[15] Karki S K, Ala-Laurinaho J, Zheng J, Lahti M, Viikari V 2019 16 th European Radar Conference (EuRAD) Paris Expo Porte de Versailles, France, October 2–4, 2019 pp321–324
[16] Abuzaid H, Doghri A, Wu K, Shamim A 2013 IEEE MTT-S International Microwave Symposium Digest (MTT) Seattle, WA, USA, June 2–7, 2013 pp1–3
[17] Zhang T, Li L, Zhu Z, Cui T J 2019 IEEE Microw. Wirel. Compon. Lett. 29 532Google Scholar
[18] Bu S, Jin H, Wang W, Luo G, Chin K S 2019 IEEE MTT-S International Wireless Symposium (IWS) Guangzhou, China, May 19–22, 2019 pp1–3
[19] Esteban H, Belenguer A, Sánchez J R, Bachiller C, Boria V E 2017 IEEE Microw. Wirel. Compon. Lett. 27 685Google Scholar
[20] Parment F, Ghiotto A, Vuong T P, Carpentier L, Wu K 2017 IEEE MTT-S International Microwave Symposium (IMS) Honololu, HI, USA, June 4–9, 2017 pp719–722
[21] Isapour A, Kouki A 2019 IEEE Trans. Microw. Theory 67 868Google Scholar
[22] Tajima T, Song H, Yaita M 2016 IEEE Trans. Microw. Theory 64 106Google Scholar
[23] Hansen S, Kueppers S, Pohl N 2018 48th European Microwave Conference (EuMC) Madrid, Spain, September 23–27, 2018 pp117–120
[24] 赵发举 2020 硕士学位论文 (成都: 电子科技大学)
Zhao F J 2020 M. S. Dissertation (Chengdu: University of Electronic Science and Technology of China) (in Chinese)
[25] Tran T H, Hirokawa J 2011 International Conference on Advanced Technologies for Communications (ATC 2011) Da Nang, Vietnam, August 2–4, 2011 pp187–190
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