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随着三维异构集成技术的兴起与大规模应用，电感型集成电压调节器在移动终端及高算力设备中的重要性日益凸显，同时也为高频软磁薄膜材料带来了重要的发展机遇。本文基于片上薄膜功率电感的应用需求，首先梳理了坡莫合金、Co基非晶金属薄膜以及FeCo基纳米复合颗粒膜三类磁芯膜材料的优势与局限性，重点探讨了微米级厚度叠层磁芯膜所面临的技术要求与挑战。其次，几乎所有的片上电感都工作在难轴激发模式，即电感激发磁场的方向要与磁芯膜的难磁化方向平行。本文对比了两种制备大面积均匀单轴各向异性磁芯膜的工艺方法、各自特点及对静态和高频软磁性能的影响，并且分析了图形化对于磁芯膜磁畴结构、高频磁损耗的作用机制以及相应的优化策略。随后，从工艺兼容与长期服役两个维度，探讨了磁芯膜磁导率与各向异性的温度稳定性问题。尽管三类磁芯膜的居里温度和晶化温度较高，但是实际制程温度的上限会受到热对于磁性原子对取向、微观结构缺陷和晶粒尺寸的影响。最后，针对当前高频、大信号条件下磁芯膜磁损耗测试中存在的瓶颈问题进行了总结，并展望了为满足片上功率电感对更高饱和电流和更低磁损耗需求，未来磁芯膜发展的技术路径。With the rise and wide applications of 3D heterogeneous integration technology, inductive voltage regulators have become increasingly important for mobile terminals and high-computing-power devices, while also offering significant development opportunities for high-frequency soft magnetic films. Based on the requirements of onchip power inductors, we first review the advantages and limitations of three types of magnetic core films: permalloy, ·Co-based amorphous metallic films, and FeCo-based nanogranular composite films, with a focus on the technical requirements and challenges posed by several μm-thick laminated magnetic core films. Secondly, almost all on-chip inductors are hard-axis excited, meaning that the field of inductors should be parallel to the hard axis of the magnetic core. We thus compare the characteristics of two types of large-area film fabrication methods, i.e. applying in-situ magnetic field and oblique sputtering, both of which can effectively induce in-plane uniaxially magnetic anisotropy (IPUMA). Their impacts on the static and high-frequency soft magnetic properties are also compared. The influence of film patterning on the domain structures and highfrequency magnetic losses of magnetic cores, as well as corresponding countermeasures, are also briefly analyzed. Furthermore, the temperature stability of magnetic permeability and anisotropy of magnetic core films is discussed from the perspectives of process compatibility and long-term reliability. Although the Curie temperature and crystallization temperature of the three types of magnetic core films are relatively high, the upper limits of their actual process temperatures are affected by the thermal effects on the alignment of magnetic atomic pairs, microstructural defects, and grain size. Finally, the current bottlenecks in testing high-frequency and large-signal magnetic losses of magnetic core films are addressed, and potential technical approaches for achieving magnetic core films that meet the future demands of on-chip power inductors for higher saturation current and lower magnetic losses are outlined.
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Keywords:
- integrated voltage regulator /
- on-chip inductor /
- soft magnetic film /
- high frequency magnetic loss
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