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Gao Jian, Li Jian-Ying. Influence of confined phase transition on dielectric relaxation characteristics of thermochromic epoxy insulating materials. Acta Physica Sinica,
2023, 72(10): 107701.
doi: 10.7498/aps.72.20230253
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Yu Sen-Jiang. Atomic force microscopy studies on self-organized wrinkles in constrained metallic films deposited on silicone oil substrates. Acta Physica Sinica,
2014, 63(11): 116801.
doi: 10.7498/aps.63.116801
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Wu Zhen-Yu, Dong Si-Wan, Liu Yi, Chai Chang-Chun, Yang Yin-Tang. Resistometric study on electromigration failure in copper interconnects. Acta Physica Sinica,
2012, 61(24): 248501.
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Wu Zhen-Yu, Yang Yin-Tang, Chai Chang-Chun, Liu Li, Peng Jie, Wei Jing-Tian. A microstructure-based study on electromigration in Cu interconnects. Acta Physica Sinica,
2012, 61(1): 018501.
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Hu Yong, Yan Hong-Hong, Lin Tao, Li Jin-Fu, Zhou Yao-He. Free volume evolution of pre-annealed Zr55Al10Ni5Cu30 bulk metallic glass during rolling. Acta Physica Sinica,
2012, 61(8): 087102.
doi: 10.7498/aps.61.087102
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Huang Ming-Liang, Chen Lei-Da, Zhou Shao-Ming, Zhao Ning. Effect of electromigration on interfacial reaction in Ni/Sn3.0Ag0.5Cu/Au/Pd/Ni-P flip chip solder joints. Acta Physica Sinica,
2012, 61(19): 198104.
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Chen Yan, Jiang Min-Qiang, Dai Lan-Hong. Temperature-dependent yield asymmetry between tension and compression in metallic glasses. Acta Physica Sinica,
2012, 61(3): 036201.
doi: 10.7498/aps.61.036201
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He Liang, Du Lei, Huang Xiao-Jun, Chen Hua, Chen Wen-Hao, Sun Peng, Han Liang. Non-Gaussian analysis of noise for metal interconnection electromigration. Acta Physica Sinica,
2012, 61(20): 206601.
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Lu Yu-Dong, He Xiao-Qi, En Yun-Fei, Wang Xin, Zhuang Zhi-Qiang. Directional diffusion of atoms in metal strips/bump interconnects of flip chip. Acta Physica Sinica,
2010, 59(5): 3438-3444.
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Lu Yu-Dong, He Xiao-Qi, En Yun-Fei, Wang Xin, Zhuang Zhi-Qiang. Electromigration in Sn3.0Ag0.5Cu flip chip solder joint. Acta Physica Sinica,
2009, 58(3): 1942-1947.
doi: 10.7498/aps.58.1942
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Li Ming-Yu, Gu Pei-Fu, Zhang Jin-Long, Zheng Zhen-Rong, Liu Xu. Study on the property of subwavelength imaging in a metal thin-film structure. Acta Physica Sinica,
2008, 57(7): 4564-4569.
doi: 10.7498/aps.57.4564
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Wu Ying-Cai, Gu Zheng-Tian. Research on the optimum thickness of metallic thin film utilized to excite surface plasmon resonance. Acta Physica Sinica,
2008, 57(4): 2295-2299.
doi: 10.7498/aps.57.2295
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He Liang, Du Lei, Zhuang Yi-Qi, Li Wei-Hua, Chen Jian-Ping. Multiscale entropy complexity analysis of metallic interconnection electromigration noise. Acta Physica Sinica,
2008, 57(10): 6545-6550.
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. The surface mapping and crystal orientation of body-centered cubic thin metal tungsten films of different thickness. Acta Physica Sinica,
2007, 56(12): 7248-7254.
doi: 10.7498/aps.56.7248
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Chen Chun-Xia, Du Lei, He Liang, Hu Jin, Huang Xiao-Jun, Wei Tao. Fractal character of noise in electromigration in metel interconnection. Acta Physica Sinica,
2007, 56(11): 6674-6679.
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. Research on noise correlation dimension of metallic interconnection electromigration. Acta Physica Sinica,
2007, 56(12): 7176-7182.
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Zhang Wen-Jie, Yi Wan-Bing, Wu Jin. Electromigration in Al interconnects and the challenges in ultra-deep submicron technology. Acta Physica Sinica,
2006, 55(10): 5424-5434.
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Li Gong, Sun Yi-Nan, Gao Yun-Peng, Zhang Xin-Yu, Luo Cong-Ju, Liu Ri-Ping. Study on free volume change in the NiP amorphous alloy under high pressure using synchrotron radiation. Acta Physica Sinica,
2006, 55(10): 5394-5397.
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Zong Zhao-Xiang, Du Lei, Zhuang Yi-Qi, He Liang, Wu Yong. Modeling of resistance changes based on the free volume in VLSI interconnection electromigration. Acta Physica Sinica,
2005, 54(12): 5872-5878.
doi: 10.7498/aps.54.5872
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Wang Jing-Feng, Liu Lin, Pu Jian, Xiao Jian-Zhong. The rheological behavior of bulk metallic glass Zr41Ti14Cu12.5Ni10Be22.5. Acta Physica Sinica,
2004, 53(6): 1916-1922.
doi: 10.7498/aps.53.1916
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