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考虑非均匀温度分布效应的缓冲器插入最优尺寸研究

王增 董刚 杨银堂 李建伟

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考虑非均匀温度分布效应的缓冲器插入最优尺寸研究

王增, 董刚, 杨银堂, 李建伟

Study on optimal size of repeater insertion with ununiform temperature distribution

Wang Zeng, Dong Gang, Yang Yin-Tang, Li Jian-Wei
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  • 基于非均匀温度分布效应对互连延时的影响, 提出了一种求解互连非均匀温度分布情况下的缓冲器最优尺寸的模型. 给出了非均匀温度分布情况下的RC互连延时解析表达式, 通过引入温度效应消除因子, 得出了最优插入缓冲器尺寸以使互连总延时最优. 针对90 nm和65 nm工艺节点, 对所提模型进行了仿真验证, 结果显示, 相较于以往同类模型, 本文所提模型由于考虑了互连非均匀温度分布效应, 更加准确有效, 且在保证互连延时最优的情况下有效地提高了芯片面积的利用.
    Based on the influence of nonuniform temperature distribution on interconnect delay, an analytical model to estimate the optimal size of repeaters inserting RC interconnect is presented in this paper. In the proposed analytical model the temperature distribution is taken into account and a temperature correction factor is introduced to modify the repeater size and obtain the optimal interconnect delay. Adopting parameters of 90 nm and 65 nm process technology, the proposed model is compared with the model without considering the temperature distribution. Results show that the new model is more accurate and saves the repeater insertion area with maximum values of 15.6% and 36.7% in 90 nm and 65 nm technology, respectively.
    • 基金项目: 国家自然科学基金(批准号: 60606006)、国家杰出青年基金(批准号: 60725415)和西安电子科技大学基本科研业务费资助的课题.
    • Funds: Project supported by the National Natural Science Foundation of, China (Grant No. 60606006), the National Science Found for Distinguished Young Scholars, China (Grant No. 60725415), and Basic Science Research Fund in Xidian University, China.
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    Hasani F, Masouni N 2008 3th Int. Conf. on Design and Technologyof Integrated Systems in Nanoscale Era p1

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    Zhu Z M, Qian L B, Yang Y T 2009 Chin. Phys. B 18 1188

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    Bakoglu H B 1990 Circuits, Interconnections, and Packaging forVLSI (New Jersey: Addison-Wesley Publishing Company) p127

    [15]

    Alpert C, Devgan A 1997 Proc. of 34th DAC p588

    [16]

    Otten R H J M, Brayton R K 1998 Proc. of 35th DAC p122

    [17]

    Ajami A H, Banerjee K, Pedram M 2001 IEEE/ACM Int. Conf.on CAD p44

    [18]

    Ja C K, Ismail Y 2007 IEEE Trans. on Very Large Scale Integration(VLSI) Systems 15 963

    [19]

    Ajami A H, Banerjee K 2005 IEEE Trans. on Computer-AidedDesign of Integrated Circuits and Systems 24 849

    [20]

    Ajami A H, Banerjee K, Pedram M 2001 Proc. of 38th DAC p567

    [21]

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  • [1]

    Morgenshtein A, Friedman E G, Cinosar R, Kolodny A 2010 IEEETrans. on Very Large Scale Integration (VLSI) Systems 18 689

    [2]

    Zeng J K, Chen C P 2010 11th Int. Symposium on ISQED p818

    [3]

    Saini S, Kumar A M, Veeramachaneni S 2010 23rd Int. Conf. onVLSI Design p411

    [4]

    El-Moursy M A, Friedman E G 2007 Integration the VLSI Journal40 461

    [5]

    Wang Z, Dong G, Yang Y T, Li J W 2011 Chin. Sci. Bull. 56617 (in Chinese) [王增, 董刚, 杨银堂, 李建伟 2011科学通报 56 617]

    [6]

    Wang Z, Dong G, Yang Y T, Li J W 2010 Chin. J. Electron. 19 43

    [7]

    Wang Z, Dong G, Yang Y T, Li J W 2010 Acta Phys. Sin. 59 5646(in Chinese) [王增, 董刚, 杨银堂, 李建伟 2010物理学报 59 5646]

    [8]

    Tang M, Mao J F 2008 Int. Conf. on Microwave and MillimeterWave Technology 2 479

    [9]

    Hasani F, Masouni N 2008 3th Int. Conf. on Design and Technologyof Integrated Systems in Nanoscale Era p1

    [10]

    Zhu Z M, Qian L B, Yang Y T 2009 Chin. Phys. B 18 1188

    [11]

    Li X, Wang J M, Tang W Q 2009 Acta Phys. Sin. 58 3603 (inChinese) [李鑫, Wang J M, 唐卫清 2009 物理学报 58 3603]

    [12]

    Zhu Z M, Qian L B, Yang Y T 2009 Acta Phys. Sin. 58 2631 (inChinese) [朱樟明, 钱利波, 杨银堂 2009 物理学报 58 2631]

    [13]

    Wang J P, Hao Y 2009 Acta Phys. Sin. 58 4267 (in Chinese) [王俊平, 郝跃 2009 物理学报 58 4267]

    [14]

    Bakoglu H B 1990 Circuits, Interconnections, and Packaging forVLSI (New Jersey: Addison-Wesley Publishing Company) p127

    [15]

    Alpert C, Devgan A 1997 Proc. of 34th DAC p588

    [16]

    Otten R H J M, Brayton R K 1998 Proc. of 35th DAC p122

    [17]

    Ajami A H, Banerjee K, Pedram M 2001 IEEE/ACM Int. Conf.on CAD p44

    [18]

    Ja C K, Ismail Y 2007 IEEE Trans. on Very Large Scale Integration(VLSI) Systems 15 963

    [19]

    Ajami A H, Banerjee K 2005 IEEE Trans. on Computer-AidedDesign of Integrated Circuits and Systems 24 849

    [20]

    Ajami A H, Banerjee K, Pedram M 2001 Proc. of 38th DAC p567

    [21]

    Zhu Z M, Zhong B, Hao B T, Yang Y T 2009 Acta Phys. Sin. 587124 (in Chinese) [朱樟明, 钟波, 郝报田, 杨银堂 2009 物理学报 58 7124]

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出版历程
  • 收稿日期:  2010-06-28
  • 修回日期:  2011-07-04
  • 刊出日期:  2012-03-05

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