内嵌CuO薄膜对并五苯薄膜晶体管性能的改善

聂国政; 邹代峰; 钟春良; 许英

doi:10.7498/aps.64.228502

摘要

制备了基于内嵌氧化物铜(CuO)薄膜的并五苯薄膜晶体管器件. 将3 nm CuO薄膜内嵌入到并五苯(pentacene)中, 作为空穴注入层, 降低电极与并五苯之间的空穴注入势垒. 相对于纯并五苯薄膜晶体管器件, 研制的晶体管的迁移率、阈值电压(VTH)、电流开关比(Ion/Ioff) 等参数都有明显改善. X射线光电子能谱数据表明, 这种空穴注入势垒的降低源自并五苯向CuO的电子转移.

关键词:

Organic thin-film transistor (OTFT) based on pentacene semiconductor with an embedded copper oxide (CuO) thin layer is investigated. With the 3 nm-thick CuO layer embedded in the pentacene semiconductor, the drain current of the OTFT increases more than 3 times compared with that of pentacene organic field-effect transistor without CuO layer, and the absolute threshold voltage reduces from -21 V to -7.9 V. The hole mobility and current on/off ratio are much improved. It is interpreted by the mechanism based on the analysis of the interface charge transfer between pentacene layer and CuO layer. Results of X-ray photoelectron reveal electron transfer from pentacene to high work function CuO and the formation of charge transfer (CT) complexes based on electron transfer near the contact of CuO and pentacene. The CT complexes between pentacene layer and CuO layer could reduce the exponential density of state near the band edge of pentacene and the pentacene bulk hole trap density, and enhance the pentacene bulk hole carriers injection, which leads to the improvement of the field-effect mobility of OTFT with CuO layer. Electrons are transfered from the highest occupied molecular orbital of pentacene to the thin CuO layer which can generate holes in pentacene. The generated hole has the same effect as that with applying negative gate voltage which influences the threshold voltage. The drain current of the device increases and the threshold voltage shifts from -21 V to -7.9 V. Therefore, the thin CuO layer that is directly embedded in the organic semiconductor layer, serves as the hole-injection layer, which is responsible for reducing the contact barrier of OTFT with CuO layer.

Keywords:

作者及机构信息

1.
湖南科技大学物理与电子科学学院, 湘潭 411201;

2.
华南理工大学高分子光电材料与器件研究所, 发光材料与器件国家重点实验室, 广州 510640;

3.
湖南工业大学理学院, 株洲 412007

通信作者: 聂国政, gzhnie@hnust.edu.cn

基金项目: 国家自然科学基金(批准号: 11447212, 11204076)、湖南省教育厅科学研究项目(批准号: 13C323) 和湖南省自然科学基金项目(批准号: 2015JJ3060)资助的课题.

Authors and contacts

1.
School of Physics and Electronic Science, Hunan University of Science and Technology, Xiangtan 411201, China;

2.
State Key Laboratory of Luminescent Materials and Devices, Institute of Polymer Optoelectronic Materials and Devices, South China University of Technology, Guangzhou 510640, China;

3.
College of Science, Hunan University of Technology, Zhuzhou 412007, China

Corresponding author: Nie Guo-Zheng, gzhnie@hnust.edu.cn

Funds: Project supported by the National Natural Science Foundation of China (Grant Nos. 11447212, 11204076), the Scientific Research Fund of Hunan provincial Education Department, China (Grant No. 13C323), the Natural Science Foundation of Hunan Province, China (Grant No. 2015JJ3060).

参考文献

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施引文献

[1]	Dimitrakopoulos C D, Malenfant P R L 2002 Adv. Mater. 14 99
[2]	Crone B K, Dodabalapur A, Sarpeshkar R, Filas R W, Lin Y Y, Bao Z, O'Neill J H, Li W, Katz H E 2001 J. Appl. Phys. 89 5125
[3]	Li H Q, Yu J S, Huang W, Shi W, Huang J 2014 Chin. Phys. B 23 038505
[4]	Yu X G, Yu J S, Huang W, Zeng H J 2012 Chin. Phys. B 21 117307
[5]	Nie G Z, Peng J B, Zhou R L 2011 Acta Phys. Sin. 60 127304 (in Chinese) [聂国政, 彭俊彪, 周仁龙 2011 物理学报 60 127304]
[6]	Duan P F, Hu Y S, Guo X Y, Liu X Y, Fan Y 2015 Chin. J. Lumin. 36 480 (in Chinese) [端鹏飞, 胡永生, 郭晓阳, 刘星元, 范翊 2015 发光学报 36 480]
[7]	Nausieda I, Ryu K K, He D D, Akinwande A I, Bulovic V, Sodini C G 2010 IEEE Trans. Electron Devices 57 3027
[8]	Chung Y, Johnson O, Deal M, Nishi Y, Murmann B, Bao Z 2012 Appl. Phys. Lett. 101 063304
[9]	Kergoat L, Herlogsson L, Piro B, Pham M C, Horowitz G, Crispin X, Berggren M 2012 PNAS 109 8394
[10]	Moon H, Im D, Yoo S, Menber 2013 IEEE Electron Device Lett. 34 1014
[11]	Wu D, Zhang Q, Tao M 2006 Phys. Rev. B 73 235206
[12]	Murdoch G B, Greiner M, Helander M G, Wang Z B, Lu Z H 2008 Appl. Phys. Lett. 93 083309
[13]	Koffyberg F P, Benko F A 1982 J. Appl. Phys. 5 1173
[14]	Park J W, Baeg J, Ghim J, Kang S J, Park J H, Kim D Y 2007 Electrochem. Solid-State Lett. 10 H340
[15]	Koch N, Ghijsen J, Johnson R L, Kahn A, Ghijsen J, Pireaux J J, Schwartz J, Johnson R L, Elschner A 2003 Appl. Phys. Lett. 82 70
[16]	Matsushima T, Kinoshita Y, Murata H 2007 Appl. Phys. Lett. 91 253504
[17]	Walzer K, Maennig B, Pfeiffer M, Leo K 2007 Chem. Rev. 107 1233
[18]	Gao W, Kahn A 2001 Appl. Phys. Lett. 79 4040
[19]	Minari T, Miyadera T, Tsukagoshi K, Aoyagi Y, Ito H 2007 Appl. Phys. Lett. 91 053508
[20]	Maennig B, Pfeiffer M, Nollau A, Zhou X, Leo K, Simon P 2001 Phys. Rev. B 64 195208
[21]	Yoneya N, Noda Hirai M, Wada M, Kasahara J 2004 Appl. Phys. Lett. 85 4663

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